comment on this article

Alliance Memory launches high speed CMOS mobile low-power SDRAMs

Alliance Memory has expanded its high-speed CMOS mobile low-power SDRAMs offering with a new LPDDR4X device featuring on-chip ECC.

Offering an extension to the company's fourth-generation LPDDR4 SDRAMs, the 8Gb AS4C256M32MD4V-062BAN offers ~50% lower power ratings in the 200-ball FBGA package for higher power efficiency.

With low-voltage operation of 0.6V - compared to 1.1V for LPDDR4 SDRAMs - the device increases battery life in portable electronics for the consumer, commercial, and industrial markets, including smart phones, smart speakers, and other IoT devices utilizing AI and 5G technologies.

Providing increased efficiency for advanced audio and ultra-high-resolution video in embedded applications, the LPDDR4X SDRAM delivers fast clock speeds of 1.6GHz for extremely high transfer rates of 3.2Gbps. For automotive applications, the AEC-Q100-qualified devices operate over a temperature range of -40°C to +105°C.

The AS4C256M32MD4V-062BAN is organised as two channels per device, with individual channels consisting of eight banks of 16 bits. The component offers fully synchronous operation; programmable read and write burst lengths of 16, 32, and on the fly; and selectable output drive strength. An on-chip temperature sensor controls the self-refresh rate.

Alliance Memory's LPDDR4X SDRAM has been designed to provide a reliable drop-in, pin-for-pin-compatible replacement for numerous similar solutions in high-bandwidth, high-performance memory system applications, eliminating the need for costly redesigns and part requalification.

Samples and production quantities are available now.

Author
Neil Tyler

Comment on this article


This material is protected by MA Business copyright See Terms and Conditions. One-off usage is permitted but bulk copying is not. For multiple copies contact the sales team.

What you think about this article:


Add your comments

Name
 
Email
 
Comments
 

Your comments/feedback may be edited prior to publishing. Not all entries will be published.
Please view our Terms and Conditions before leaving a comment.

Related Articles

NAND mobile solution

Micron Technology has begun volume shipments of the world’s first 176-layer ...

Urban design

What does the future hold for cities in a post-pandemic world and how can ...

16 Mp XGS sensor

ON Semiconductor has introduced the latest addition to the XGS series of CMOS ...

Get to market faster

A quick look at using Vicor's PFM and AIM in VIA packaging for your AC to Point ...

World IoT Day

ByteSnap Design, a specialist in embedded systems design and development, has ...

End game

How are IoT technologies keeping vaccines safe, in storage and transit, and in ...