08/05/2019
Infineon enters high volume production of a portfolio of 1200 V CoolSiC MOSFET devices.
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18/02/2019
An all-in-one online tool from STMicroelectronics is designed to simplify motor-control designs using STM32 and STM8 microcontrollers (MCUs).
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12/06/2018
Solid State Supplies is offering a range of memory products from SMART Modular Technologies.
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24/01/2018
The SARA-R412M is said to be the world's smallest multi-mode LTE Cat M1, NB-IoT (NB1), and quad-band 2G solution to offer global configurability in a single hardware version.
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07/02/2017
A new generation transistor array has been launched by Toshiba Electronics Europe for applications such as LED lighting and industrial, high voltage signal transmitters. The TBD62089APG incorporates 8bit, D-type flip flop circuits that support a data storage function.
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29/06/2016
Microchip Technology has announced the company’s lowest power and most cost-effective family of 32-bit PIC32 microcontrollers (MCUs). The Microchip PIC32MM family is claimed to bridge the gap between the company’s PIC24F XLP and PIC32MX families. The family is said to be the first PIC32 to feature core independent peripherals, designed to offload the CPU for lower power and lower system design. The PIC32MM devices are supported by the Microchip MPLAB Code Configurator (MCC) to help simplify and accelerate designs.
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17/06/2016
Fischer Connectors has launched the USB 3.0 version of its portable, miniature, lightweight and tough Fischer Rugged Flash Drive. The memory stick has been designed for the safe transportation and storage of sensitive data in harsh environments.
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08/06/2016
Silego Technology has released a family of high-performance, GFET3 integrated power switches. Operating from 2.5 to 5.5V supplies, these single-channel GFET3 nFET integrated power switches are designed for all high-side, 0.8 to 5.5V power rail applications.
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06/06/2016
Murata has announced a series of two 2.4GHz IEEE802.11 b/g/n compliant wireless modules based around the TI CC3200 and TI CC3100 SimpleLink chipsets. These miniature modules, measuring 13.2 x 21.45 x 2.65mm are claimed to ease incorporating wireless internet connectivity to a host of embedded applications and especially internet of things (IoT) designs.
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12/05/2016
PTC has released ThingWorx 7, the latest version of its Internet of Things (IoT) platform. Robust, scalable, and easy to use, ThingWorx is said to enable designers to develop and deploy smart, connected IoT solutions. The platform is said to contain one of the most complete sets of integrated IoT-specific development tools and capabilities, making feature-rich solution development simple while accelerating time-to-market.
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12/05/2016
ABB has launched a scalable power distribution and protection solution for use in data centre applications. ABB’s MNS-Up solution integrates uninterrupted power supply (UPS) and switchgear technologies into a single, modular system, which is claimed to lower footprint by up to 30%, increase uptime, and reduce maintenance costs.
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09/05/2016
Toshiba has introduced the SSM6L61NU and SSM6N61NU two-in-one MOSFETs.These MOSFETs, are housed in compact SOT-1118 (UDFN6) packages, and are claimed to feature high heat dissipation and low drain-source ON-resistance. These features are said to make them suitable for use as power management switches and DC/DC converters in mobile devices, including smartphones and tablets. The SSM6L61NU and SSM6N61NU can also be used in battery management applications and for load switching in applications with USB Type-C interfaces.
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09/05/2016
Infineon Technologies has added a number of wide body package options to its EiceDRIVER Compact family of galvanically isolated gate driver ICs. The 1EDI Compact 300 mil devices are supplied in a DSO-8 300 mil package offering increased creepage distances and improved thermal behaviour.
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20/04/2016
Powervar has developed two IoT products that enable facilities managers to use next generation site monitoring to gain an in-depth insight of not only their energy use, but also the state of health of their key assets.
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24/03/2016
nanoPrecision Products has unveiled third-party optical and environmental testing data that show the Ferrolder, the company’s next generation fibre optic connector, over-performs traditional ceramic SC style ferrules and connectors.
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17/03/2016
Components Bureau has introduced the JFG series of axial lead, metallised polyester and polypropylene film capacitors from jb Capacitors to the UK market. The compact capacitors are said to feature high-temperature resistance, large capacity and good self-healing properties, they are suitable for use in instrument applications and DC and AC circuits of household equipment, as well as the fractional frequency circuit of acoustic systems.
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15/03/2016
Tektronix has introduced the P7700 series of TriMode probes for use with Tektronix performance oscilloscopes. Claimed to offer up to 20GHz bandwidth, the probes are said to ease the challenges designers face when debugging circuits found in the latest mobile and enterprise designs by minimising probe loading, improving access to smaller, more-densely packed test locations and lowering overall cost of ownership.
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11/03/2016
Microsemi has released version 11.7 of its Libero system-on-chip (SoC), a suite of FPGA design tools used with the company’s FPGA products. The release includes a number of new features to enhance ease-of-use and efficiency for designers, as well as security and evaluation tools, for its RTG4 FPGAs, SmartFusion2 SoC FPGAs and IGLOO2 FPGAs, speeding time to market for designers.
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11/03/2016
Infineon Technologies is expanding it CoolMOS CE portfolio with a SOT-223 package. This package is claimed to offer a cost effective alternative to DPAK as well as space savings in some designs. The SOT-223 package without middle pin is said to be compatible with a typical DPAK footprint and can be used as a drop-in replacement for DPAK for designs in LED lighting and mobile charger applications.
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10/03/2016
Toshiba has unveiled the TC78B016FTG, a three-phase brushless motor driver IC that is claimed to achieve high efficiency and minimal noise at a range of rotational speeds without any need for phase adjustment. The TC78B016FTG is optimised for use in the small fan motors found in home appliances and industrial equipment.
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08/03/2016
Analog Devices claims further advances in digital processing are needed to unlock the full potential of inverters. Looking to meet this need, it unveiled the ADSP-CM41x control processor.
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07/03/2016
Bourns’ 15V bidirectional high current power TVS Diode for use in high power DC bus clamping applications is now available in Europe through TTI.
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03/03/2016
Toshiba has launched the TBD62783A series of highly efficient transistor arrays, said to be the industry’s first with a DMOS FET type source-output driver. This series succeeds the TD62783 series of bipolar transistor arrays, claimed to cut power loss by around 40% and is suitable for a range of applications including LED drives.
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01/03/2016
Diodes Incorporated has introduced the DGD21xx series of devices that are claimed to provide a simple means of switching power MOSFETs and IGBTs in half- and full-bridge configurations. Target applications include driving motors in white goods, industrial automation systems and battery-operated vehicles such as eBikes and drones. They are also suited for power supplies above 600W and inverters in fuel cell, solar and wind power applications.
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12/02/2016
Dielectric Laboratories (DLI), a Knowles brand, has announced a number of specification extensions to its ultra-low ESR and high Q MLC capacitors. In both cases the temperature performance has been increased to 175°C giving engineers more scope in their designs.
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