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New Electronics brings you the latest product and component news from market leading suppliers. Technology areas covered include microcontrollers, test & measurement, power, electronic design automation, embedded software and programmable logic, amongst others.

KEMET extends KC-LINK range using KONNEKT packaging technology

KEMET is extending its popular KC-LINK range using KONNEKT high-density packaging technology to meet the growing demand for fast-switching wide bandgap (WBG) semiconductors, EV/HEV, LLC resonant converters, and wireless charging applications.

This technology combines KC-LINK’s C0G Base Metal Electrode (BME) dielectric system with KONNEKT’s iTransient Liquid Phase Sintering (TLPS) material to create a surface mount multi-chip solution that's well-suited for both ...

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