16 April 2014 Ask the Expert: How does TI’s integrated RFIC simplify the design process? Nikolaus Klemmer, High Speed Products, has been developing communcations transceiver SoCs with Texas Instruments since 2010. Since the emergence of 2G mobile technology, he has been active in the development of numerous RF transceiver ICs for mobile applications. He is a senior member of the IEEE, has published 11 papers, and has been granted more than 20 patents in analog and RF circuit and system design. From 2007-2011 he was member of the IEEE ISSCC Technical Program Committee, as chair of the RF and PLL sub-committees. He has a M.Sc. degree in Physics from the Technical University of Munich, Germany. Author Texas Instruments Comment on this article Websites http://www.ti.com/lit/sprt691 Companies Texas Instruments Deutschland This material is protected by MA Business copyright See Terms and Conditions. One-off usage is permitted but bulk copying is not. For multiple copies contact the sales team. What you think about this article: Add your comments Name Email Comments Your comments/feedback may be edited prior to publishing. Not all entries will be published. Please view our Terms and Conditions before leaving a comment.
16 April 2014 Ask the Expert: How does TI’s integrated RFIC simplify the design process? Nikolaus Klemmer, High Speed Products, has been developing communcations transceiver SoCs with Texas Instruments since 2010. Since the emergence of 2G mobile technology, he has been active in the development of numerous RF transceiver ICs for mobile applications. He is a senior member of the IEEE, has published 11 papers, and has been granted more than 20 patents in analog and RF circuit and system design. From 2007-2011 he was member of the IEEE ISSCC Technical Program Committee, as chair of the RF and PLL sub-committees. He has a M.Sc. degree in Physics from the Technical University of Munich, Germany. Author Texas Instruments Comment on this article Websites http://www.ti.com/lit/sprt691 Companies Texas Instruments Deutschland This material is protected by MA Business copyright See Terms and Conditions. One-off usage is permitted but bulk copying is not. For multiple copies contact the sales team. What you think about this article: Add your comments Name Email Comments Your comments/feedback may be edited prior to publishing. Not all entries will be published. Please view our Terms and Conditions before leaving a comment.
Hi-speed contactless connector STMicroelectronics and Rosenberger, a manufacturer of impedance-controlled and ...
Modular RF designs Guerrilla RF (GRF) has entered into a collaboration with X-Microwave to offer a ...
SoCs for the 5G revolution In 2019 the first companies started to test and deploy small sub-systems, with ...
How to Select the Correct Spri Connectivity is more crucial than ever in modern electronics designs. The ...
New life for embedded systems The Internet of Things (IoT) is no longer a fanciful vision. It is very much ...
Getting started with the IoT This whitepaper details how you as a stakeholder will benefit from the Internet ...
Top five Raspberry Pi projects The Raspberry Pi 3 Model B is said to deliver up to ten times the processing ...
Entering the mainstream? Earlier this year Vodafone’s annual IoT Barometer found that a significantly ...
The Internet of Java Things The Internet of Things (IoT) has become a hot topic over the last few years. ...
ESD suppression design guide Choosing the most appropriate ESD suppression technology requires a balance ...
Opening up the Indian market Smiths Interconnect has expanded its presence in India, as Giuseppe Lancella ...
Managing social distancing Flow management and social distancing are critical when it comes to crowd ...
