Technology Spotlights Filtered by - Enclosures, Backplanes & Boards

New Electronics strives to bring you all the latest technology news from the Enclosures, Backplanes & Boards sector. Advances in electronics are often fast-paced and innovative, so we know that as a design engineer you want to be kept up-to-date with current developments.

Below is a comprehensive list of all the latest electronics technology news from New Electronics.

Artesyn’s MaxCore Platform: Innovative PCIe Microserver

The Artesyn MaxCore™ platform offers a versatile and dense architecture to achieve maximum compute and media processing density. You can use Artesyn microserver cards and PCI Express acceleration cards and standard 3rd party PCIe cards to build a platform for SDN/NFV, virtualized multiscreen video, OTT, WebRTC, VoLTE, and other high performance networked computing applications. Industrial applications include semiconductor manufacturing, while military and aerospace applications include radar and sonar.

ARBOR Technology introduces Intel Braswell-Based Qseven modules

ARBOR Technology has announced the immediate release of the EmQ-i2200 Qseven module. Available in dual and quad-core formats, the 70 x 70mm modules can support up to three HD displays or two 4k displays, being capable of streaming 4K video in real time. Suitable for a whole range of fanless and rugged embedded computer designs, EmQ-i2200 modules provide native USB 3.0, UART, SDIO, I2C and LPC bus, as well as three PCIe lanes.

Demystifying EMC 2016

Following on from the successful event in 2015, Rohde & Schwarz is hosting Demystifying EMC 2016 on Monday 18th January 2016 at The Royal Berkshire Conference Centre at Reading's Madjeski Stadium.

Electronics Design Show conference programme announced

The line up for this year's conference programme has been confirmed and is now available to view online. Join us on 21-22 October to hear from industry giants such as ARM, Cambridge Consultants, and EE. There will also be keynotes from representatives from e2v, Cambridge University and Freescale.

har-flex® the versatile, space-saving connector range.

har-flex® is a flexible, rugged PCB connector series, based on 1.27mm grid with SMT termination. Available with 6 to 100 contacts and with a robust design, har-flex® provides connectivity solutions for many different board-to-board and cable-to-board applications. har-flex® provides significant real estate saving on the PCB due to the 1.27mm pitch and is packaged for automated processing.

METCASE 19” Front Panel Handles Now Available As Accessories

OKW's metal enclosures division METCASE has added extruded handles to its range of accessories for custom 19" front panels, rack cases and chassis. They make it easier to fit the front panels or chassis into cabinets or remove them during installation and maintenance – speeding up servicing.

Electronics Design Show: Will you be attending?

The Electronics Design Show opened today. If you haven't pre-registered there is still time to attend. Don't miss out on your chance to visit this exclusive event and the opportunity to learn from and engage with industry experts through FREE workshop and conference sessions.

Innovative New NET-BOX Wall Mount Enclosures From OKW

OKW has launched NET-BOX – a sleek new range of innovative wall mount enclosures for control and data applications. These modern and attractive enclosures feature an inset cable connection panel – hiding unsightly connectors under the removable front lid.

Highly integrated EBX single board computer features Intel Atom E680T CPU and on-board data acquisition

Diamond Systems introduces Hercules III, a rugged single board computer in the EBX form factor based on the Intel Atom E680T CPU running at 1.6GHz, and featuring 2 Gigabit Ethernet ports, 6 serial ports, and 5 USB 2.0 ports. Hercules III is the newest member of Diamond's 2-in-1 SBC products, combining a standard CPU board's features with industry leading data acquisition on a single board.

Round IP 66 Die cast Enclosures Range Extended

ROLEC has added three further sizes to its unique aluDISC range of round die cast aluminium enclosures. These groundbreaking off-the-shelf housings are suitable for both indoor and outdoor industrial electronics and electrical equipment.

Bioplastic Hand Held Enclosures From Stock!

The SOFT-CASE series of hand held enclosures from OKW is now available from stock manufactured in BIOGRADE® bioplastic material. For most applications this bioplastic is suitable as a replacement for the existing fossil plastics, such as ABS, which has been used until now.

Better safe than sorry!

The fastest and safest compact COM Express Module: conga-TC87 supports built-in security features which help to protect your data against unauthorized access. conga-TC87 COM Express Compact Type 6 Featuring the 4th Generation of Intel® Core™ i7 Processors • Intel® AES–NI for accelerated de-/encryption without additional CPU load • Intel ® Secure Key to produce high quality cryptographic keys • Intel® Platform Trust Technology for boot sequence control

Subscribe to our Newsletter