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Seeing the light

Wireless and fibre to the home will benefit from optical integration. By Louise Joselyn.

The optoelectronics world is poised for a step change in technology development, if the latest hybrid assembly technique introduced by Centre for Integrated Photonics (CIP, is adopted widely.
Described as the photonics equivalent of the emergence of the printed circuit board, CIP’s simple method of integrating optoelectronic components promises higher integration, scalability and lower cost in high volume manufacturing applications, while also delivering performance.
The development comes at time when potential high volume applications, such as fibre to the home, are close to fruition and manufacturers are seeking low cost production options. Meanwhile, the burgeoning wireless market is increasing demand for advanced, low cost optical networking solutions.
CIP’s technique sounds simple enough – essentially using a planar silica waveguide device as the motherboard, with plug in silicon based daughter boards. But it has taken a decade to perfect.

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Vanessa Knivett

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