comment on this article

High Speed, High Density Demands Drive Evolution of Samtec’s SEARAY™ Line

The latest additions to Samtec's SEARAY™ family are a Right Angle design ideal for perpendicular and high speed micro backplane applications and a Press-Fit design that combines the flexibility and convenience of press-fit tails with superior signal integrity and mechanical performance.

Samtec continues to evolve its line of SEARAY™ Open Pin Field Interconnects to support the demands of high speed applications requiring highly reliable, high pin count solutions. The latest additions to Samtec's SEARAY™ family are a Right Angle design ideal for perpendicular and high speed micro backplane applications and a Press-Fit design that combines the flexibility and convenience of press-fit tails with superior signal integrity and mechanical performance. Both designs use a 1,27mm x 1,27mm (.050" x .050") grid array to achieve maximum grounding and routing flexibility, and feature Samtec's robust, signal integrity-optimized Edge Rate™ contact system.

Right Angle SEARAY™ Terminals and Sockets (SEAM-RA/SEAF-RA Series) are optimized to reduce skew and impedance mismatch and have low insertion and extraction forces. Terminals and sockets are available in 4, 6, 8 or 10-row configurations with up to 500 I/Os. Right angle arrays mate with SEARAY™ Surface Mount (SEAM/SEAF Series) and Right Angle (SEAM-RA/SEAF-RA) Sockets and Terminals and with SEARAY™ High Density Flex Data Links (SADL Series) and High Speed Twinax Cables (SEAC Series). Optional guide posts and latching posts are ideal for rugged applications and allow for blind mating.

Press-Fit SEARAY™ Terminals (SEAMP Series) are available in 4, 6, 8 or 10-row configurations offering up to 500 I/Os. The terminals mate with a choice of SEARAY™ interfaces: Surface Mount Sockets (SEAF Series) in three standard stack heights, High Density Flex Data Links (SADL Series) for Cable-to-Board applications, or the new Right Angle Sockets (SEAF-RA Series) for multilayer PCB designs such as high speed micro backplane applications. Additional pin counts, plating options, and guide posts, as well as the required application tooling, are also available.

Samtec has also recently introduced a new 0,8mm (.0315") Micro Pitch version of its SEARAY™ High Density Interconnects (SEAM8/SEAF8 Series) offering high speed performance and the unparalleled grounding and routing flexibility of the 1,27mm (.050") pitch arrays, while requiring 50% of the board space.

Pricing begins about $ .04 cents per pin depending on quantities.

For more information please visit: http://www.samtec.com


Email:
Asia – singapore@samtec.com
Australia – australia@samtec.com
France – france@samtec.com
Germany – germany@samtec.com
United States – info@samtec.com
United Kingdom – scotland@samtec.com

Author
Samtec Ltd

Comment on this article


This material is protected by MA Business copyright See Terms and Conditions. One-off usage is permitted but bulk copying is not. For multiple copies contact the sales team.

What you think about this article:


Add your comments

Name
 
Email
 
Comments
 

Your comments/feedback may be edited prior to publishing. Not all entries will be published.
Please view our Terms and Conditions before leaving a comment.

Related Articles