12/01/2022
The recent SolarWinds hacking incident that left many fortune-500 companies and US government networks exposed is a cautionary tale for unchecked software and hardware supply chain security vulnerabilities.
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06/01/2022
Kedar Patankar considers the physical design considerations that need to be taken into account when designing AI/ML applications.
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15/12/2021
Earlier this year, Innovate UK decided to award a grant to a consortium of companies and academic groups that is working on ways to make CMOS electronics work at temperatures close to absolute zero.
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23/09/2021
Innovating in semiconductors is seen as being a critical component of the UK’s Tech Strategy, as Scott White explains.
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20/09/2021
Chris Edwards looks at how 2D scaling options could provide the basis for far more extensive 3D integration on the part of chipmakers.
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20/07/2021
New electronic product generations bring new challenges associated with thermal management and there are two general types of thermal interface materials: gels (or dispensable gap fillers) and gap filler pads which can be used.
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01/07/2021
“Extraordinary circumstances often bring along with them extraordinary strength,” wrote the political philosopher William Godwin.
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03/06/2021
As the 3nm process node nears production readiness, the cost of developing chips for it has moved up another notch.
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27/05/2021
Over the past decade, concern has grown over hardware Trojans: malicious circuitry placed in chips or boards.
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16/04/2021
If 2020 propelled the semiconductor market to new levels of demand, just wait for what 2021 and beyond have in store.
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26/03/2021
Two years ago, a team of HP was faced with the challenge of getting more airflow out of a duct used to cool the print-heads of an upcoming inkjet printer.
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15/03/2021
Adding a connected device to your portfolio can be challenging. Jonathan Pallant looks at how to pick the ‘perfect ingredients’.
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10/03/2021
Field-programmable gate arrays (FPGAs) are the dominant hardware platform in many safety-critical, low-volume applications, including aerospace and nuclear power plants (NPPs).
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21/01/2021
Is Moore's Law dead, dying or in rude health? It depends who you ask. In turn, it depends on how they are applying the ruler when it comes to measuring the scaling factors as semiconductor processes move down the nanometre curve.
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14/01/2021
Wearable medical devices allow people more control over their own health by letting them monitor themselves
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14/12/2020
5G is still in the early stages of its rollout but the attention in R&D is now on the next generation to come, even if its launch may be some way off.
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03/12/2020
Deep learning has an energy problem. Model sizes have been spiralling up, and doing so at an increasing rate as users exploit cloud servers armed with graphics processing units to crunch the numbers.
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29/10/2020
There are four trends now shaping the automotive market and in a report published in 2016 by McKinsey & Company (“Automotive revolution – perspective towards 2030”) these were identified as autonomy, connectivity, electrification and diverse mobility.
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25/09/2020
When WiFi 6 (IEEE 802.11ax) was introduced by the Wi-Fi Alliance, the standard was initially designed to operate within the licensed exempt bands between 1-6 GHz.
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09/09/2020
Although most electronics engineers understand the principles of an AC to DC power supply (PSU) and could probably design one to work, it takes specialist knowledge and skills to fully optimise it for cost, size and performance.
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03/09/2020
A quiet revolution is taking place in electronics hardware design and, as silicon integration has continued (fed by the economics of Moore’s Law), engineers are gradually moving from developing mostly at the component and circuit level to working more with board, modules and subsystems
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24/08/2020
In the coming years, Tier 1 automotive suppliers have an enormous opportunity with the development of autonomous vehicles (AVs) but there are challenges - the whole supply chain is being disrupted by new participants and new technologies.
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12/08/2020
For semiconductor manufacturers, compound semiconductor manufacturers, raw wafer material suppliers, and R&D labs, utilising wet process cleaning equipment is critical when it comes to producing extremely reliable products.
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22/07/2020
A DVCon Europe 2019 conference paper, jointly authored by Renesas and OneSpin Solutions, considered innovative chip safety analysis. In this article Jörg Grosse and Sergio Marchese discuss its findings.
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16/07/2020
The stacking and direct interconnection of PCBs is becoming increasingly popular. What are the benefits of developing the boards needed for a multi-board assembly on a single CAD canvas?
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