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Structural electronics specialist gets $23m funding boost

A Finnish developer of injection moulded structural electronics solutions has raised a further $23million in funding from existing and new investors. TactoTek says it will use the funding to expand capacity at its headquarters in Oulu, as well as improving its global engineering and sales presence.

According to the company, its technology enables the integration of flexible printed circuitry and discrete electronic components into mass-produced 3D injection moulded plastics. This, it adds, allows companies to produce differentiating and cost-effective designs which are durable and protected from the environment.

Monita Mo, CEO of new investor Ascend Capital Partners, said: “TactoTek is a leader amongst a new wave of innovators in the automotive industry that support the industry’s rapid adoption of electronic functionality to optimise existing use cases and enable new designs for smart surfaces and connectivity.”

Elements that can be incorporated by TactoTek into moulded plastics include: flexible circuitry and wiring; lighting; controls; sensors; antennas; and integrated circuits.

Typical moulding materials are said to include polycarbonate, acrylic, acrylonitrile butadiene styrene, and thermoplastic polyurethane for flexible designs.

Graham Pitcher

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