20/01/2021
Electric vehicle (EV) charging consultancy, Versinetic, is making available a suite of bespoke charging solutions aimed at accelerating the rapid rollout of smart charge points.
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20/01/2021
CEA-Leti scientists have demonstrated a machine-learning technique that exploits the “non-ideal” traits of resistive-RAM (RRAM) devices, and in the process overcoming barriers to developing RRAM-based edge-learning systems.
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20/01/2021
Qualcomm Technologies has unveiled the Snapdragon 870 5G Mobile Platform, a follow-on to the Snapdragon 865 Plus, which features an enhanced Kryo 585 CPU prime core clock speed of up to 3.2 GHz.
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19/01/2021
Farnell has been appointed as an authorised distributor by NI, expanding its product portfolio to include NI software-connected test and measurement solutions for customers of all sizes.
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19/01/2021
Renesas Electronics has announced the expansion of its range of RZ/G2 general-purpose 64-bit microprocessors (MPUs), delivering improved AI processing for a wide range of applications.
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19/01/2021
OKdo, the global technology company, is now supplying a full portfolio of products from Coral, Google’s platform for edge AI.
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19/01/2021
Rohde & Schwarz is to offer the first validated IMS conformance test cases for 5G NR that can be used for certification testing according to PTCRB.
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19/01/2021
CPI, the independent technology innovation centre and founding member of the UK Government’s High Value Manufacturing Catapult, is participating in a collaborative project – termed the Quantum Sensors project.
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18/01/2021
NXP Semiconductors has unveiled the CW641 Wi-Fi 6E Tri-Band system-on-chip (SoC), laying the foundation for a new era of Wi-Fi 6 devices that can operate in the 6GHz band.
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18/01/2021
Anglia Components is now offering an expanded range of products for passive and electromechanical timing and synchronisation thanks to a new UK and Ireland distribution agreement with Abracon.
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18/01/2021
Menta and Secure-IC have successfully co-developed a flexible solution that will allow next-generation SoCs to follow market security requirements over time.
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18/01/2021
Intel has outsourced the production of about 15-20% of its non-CPU chips, with most of the wafer starts for these products assigned to TSMC and UMC, according to TrendForce.
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