comment on this article

Wafers into solar panels

IBM has announced a semiconductor wafer reclamation process, pioneered at its Burlington fabrication plant in Vermont. The process uses a pattern removal technique to turn scrap semiconductor wafers into a form suitable for the manufacture of silicon based solar panels.

According to the company, the reclamation process can efficiently remove IP from the wafer’s surface, making them available either for reuse as ‘monitor wafers’ in house or for sale to the solar cell industry.
According to the Semiconductor Industry Association, 250,000 wafers are started each day around the world. IBM estimates that up to 3.3% of those are scrapped, amounting to some 3million scrap wafers a year.

Graham Pitcher

Comment on this article



IBM (UK) Ltd

This material is protected by MA Business copyright See Terms and Conditions. One-off usage is permitted but bulk copying is not. For multiple copies contact the sales team.

What you think about this article:

Add your comments


Your comments/feedback may be edited prior to publishing. Not all entries will be published.
Please view our Terms and Conditions before leaving a comment.

Related Articles