TE Connectivity has released a new low profile junction box for BIPV glass-glass crystalline solar modules.
The SOLARLOK wing edge junction box features an integrated and sealed one component design and is specifically designed for the easy automatic glass-glass module lamination process. The junction box is connected to the foils before the lamination process without attaching any cable assemblies. This new process allows a straightforward, clean and convenient lamination process as no silicon glue is required to mount the product with the glass edge. The process also eliminates complicated and time consuming connection work for the device after lamination, removing any risk of damage to the foils. The cable assemblies can easily be connected to the junction box in the field using SOLARLOK slim line connectors. The SOLARLOK wing edge junction box does not require any potting of the inside and benefits from very small dimensions of only 105.8x15.5x12.5mm, saving space in the installation. It is available with a 12 Amp current rating for crystalline applications. The device is TÜV approved (according to VDE0126-5) with a 1000Vdc rating to meet the performance requirements of the photovoltaic industry. It offers a connectorised solution for easy module cell expansion. It is not released for the US market. The housing of the junction box is sealed to IP67. The SOLARLOK slim line connectors feature a latching locking feature and are also sealed to IP67.