Engineering publications brought to you by Mark Allen

Semiconductors

Copper diamond composite set to power advanced semiconductor devices

Blue Cheetah tapes out chiplet interconnect IP on Samsung Foundry’s SF4X process

Cadence to acquire Secure-IC, a developer of embedded security IP

Tampere University joins EU initiative to develop a semiconductor design platform

Infineon’s PSOC Control MCU targets motor control and power conversion systems

GlobalFoundries announces ‘first-of-its-kind’ advanced packaging and photonics centre

Mouser Debuts New STMicroelectronics ST1VAFE3BX Biosensor with vAFE

TSMC set to build two additional CoWoS facilities

Alchip opens 3DIC ASIC design services

SkyWater launches ThermaView to support thermal imaging designers

US imposes new export restrictions on AI chips

NXP secures €1bn loan to advance semiconductor innovation in Europe