05 February 2013
Integrated power module targets space limited applications
Looking to meet growing demand for miniaturised multifunctional power management modules, TDK has launched a series of integrated multichannel devices targeted at smartphones, tablets and similar space limited applications.
Based on the company's semiconductor embedded in substrate (SESUB) technology, the modules are intended to reduce lead times and development costs.
The power supply management chip is embedded directly into the substrate. In combination with surface mounted capacitors and power inductors, this results in a footprint that is up to 60% smaller than discrete solutions.
The module features a high efficiency step down converter in a five channel configuration with a maximum output of 2.6 A. It also includes a low noise, low loss voltage regulator power supply for up to 23 channels and a lithium-ion secondary battery charging circuit.
This material is protected by Findlay Media copyright
One-off usage is permitted but bulk copying is not.
For multiple copies contact the