All Latest Electronics News

IBM claims quantum computing breakthroughs

IBM says its researchers have made two critical advances in their efforts to build a practical quantum computer. The team has shown that both kinds of quantum error – bit flip and phase flip – can be detected and measured simultaneously and has demonstrated a square quantum bit circuit design that is said to be the only physical architecture that could successfully scale to larger dimensions.

Li-ion thermal runaway captured by 3D imaging techniques

A team led by UCL has used 3D imaging techniques to determine what happens inside a lithium-ion battery when it overheats and then explodes. According to the researchers, it is important to understand how Li-ion batteries fail in order to improve their design to make them safer to use and transport. Recently, three airlines announced they will no longer carry bulk shipments of lithium-ion batteries after the US Federal Aviation Administration found overheating batteries could cause major fires.

AFDEC billings grow by 10%, but future still looks uncertain

The Electronic Components Supply Network (ECSN) has reported what it calls 'a welcome improvement' in total monthly billings in March 2015. Consolidated figures reported by the association's authorised distributor (AFDEC) membership show that billings increased by 10% compared to February and by 2% over March 2014.

Boron nitride increases performance of MoS2

A research team, headed by James Hone from the University of Columbia in the US, has shown that the performance of molybdenum disulphide (MoS2), a two-dimensional material, can be improved by encapsulating it in boron nitride.

Closing the gaps in carbon nanotube transistors boosts performance

While silicon based transistors have been the foundation of modern electronics, carbon nanotube wires show promise in replacing silicon because the technology can operate ten times as fast and is more flexible. However, the approach has some problems caused by gaps at the junctions between the nanotubes. Now researchers at the University of Illinois believe they may have developed a way of mitigating the problem.

Reconfigurable chip defends against memory access attacks

Researchers from MIT have designed a reconfigurable chip that is said to defend cloud based applications against memory access attacks. The concept is that, whenever a chip needs to fetch data from a particular memory address, it should also query a number of other addresses so an observer can't determine which one is of interest.

DSP core set to meet IoT, wearables processing requirements

Looking to meet the growing need for processing data acquired by sensors, Cadence has launched the Tensilica Fusion digital signal processor (DSP). Based on the Xtensa Customizable Processor, the scalable DSP core is said to be suited to applications requiring DSP computation, ultra low energy consumption and a small footprint.

Drop in replacement boosts performance, cuts power consumption

Broadcom has unveiled the next generation of its StrataXGS Trident Ethernet switch portfolio. Called the Trident-II+ series, the parts are said to be optimised to meet the bandwidth, scalability and efficiency demands of 10GbE virtualised data centres. The company adds the parts can also replace ASICs.

Semi sales see 'best growth since 2010'

Market analyst IHS says worldwide semiconductor revenues grew by 9.2% in 2014, reaching $354.5billion. According to the company, the year ended on a strong note, with fourth quarter revenues showing 9.7% improvement over Q4 2013.

USB based debug of advanced SoCs

Cambridge based UltraSoC has added USB based debugging capabilities to UltraDebug. The patented technology is said to allow a single USB 2.0 interface to be used simultaneously for system communication and applications such as debugging.

Process allows transistors to be printed on paper

A technique developed by a research team from the University of Delft is said to be capable of producing fast, low power and flexible polycrystalline silicon transistors at low cost. Tests showed the thin film transistors created using the process exhibited mobilities as high as those of conventional polysilicon conductors.

Subscribe to our Newsletter

Most popular