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Low power sub GHz radio for industrial applications

Building on its expertise in developing RF transceivers for medical applications, Microsemi has unveiled a low power sub GHz transceiver for industrial systems. According to the company, the ZL70550 brings ‘best in class’ low power characteristics, a high level of integration and an extremely small footprint.

Quantum dot work to bring ‘new era’ for electronics

A research group from Cornell University in the US believes its work with quantum dot solids might help to usher in a new era in electronics. The team, led by associate professor Tobias Hanrath, has fused together lead-selenium nanocrystal building blocks to form atomically coherent square superlattices.

Wi-Fi at 10,000 times lower power

A team of computer scientists and electrical engineers from the University of Washington claims to have generated Wi-Fi transmissions using 10,000 times less power than conventional methods. The Passive Wi-Fi system is also said to consume 1000 times less power than existing energy-efficient wireless communication platforms, such as Bluetooth Low Energy and Zigbee.

Reference design announced for USB-PD compliant fast chargers

Power Integrations and Cypress Semiconductor have announced a joint reference design describing a 20W, USB-PD compliant AC/DC power converter targeted at chargers for smart mobile devices. The design, titled DER-533, pairs the EZ-PD CCG2 USB Type-C port controller from Cypress with Power Integrations’ InnoSwitch-CP off-line CV/CC flyback switcher IC, enabling designers to produce a standards-compliant power adapter that is claimed to be fast, compact and energy-efficient.

WEEE Directive 2012/19/EU updated and expanded

Inspection, verification, testing and certification company, SGS, has expanded and updated the requirements for waste electrical and electronic equipment - WEEE Directive 20012/19/EU. Originally introduced in 2002, as Directive 2002/96/EC, the WEEE Directive has been reviewed and updated to expand its scope, and producer responsibilities.

imec to merge with iMinds

Nanoelectronics research center imec and digital research and incubation centre iMinds are to merge under the imec name. According to the partners, the merger – which is planned to complete by the end of 2016 – will create a high tech research centre for the digital economy.

Transmitter architecture suits RF CMOS SoCs

While analogue transmitters are less suitable for integration in advanced CMOS nodes, digital transmitters typically fall short when it comes to high-end performance parameters such as out-of-band noise and spurious emission.

Industry’s most powerful universal SoC debug environment

UltraSoC and Lauterbach have collaborated to create the industry’s most powerful, fully-featured independent system-on-chip (SoC) development and debug environment. The partnership brings together Lauterbach’s TRACE32 integrated, universal development system and UltraSoC’s on-chip debug and analytics IP, to ease the work of engineering teams creating advanced SoCs used in industries as diverse as mobile communications, automotive and the IoT.

Record six hour flight for UAV powered by solid hydrogen-on-demand fuel cell

A consortium of Singaporean institutions and private sector companies including have worked together to achieve a record six hour, 300km flight on the Skyblade 360 unmanned aerial vehicle (UAV) built in Singapore by ST Aerospace. This is the first time that a fuel cell has moved beyond the prototype stage and entered the standard product list of a UAV manufacturer.

Euro distributors enjoyed ‘healthy’ 2015, says DMASS

Components distribution in Europe enjoyed a rather healthy 2015, according to DMASS, the Distributors’ and Manufacturers’ Association of Semiconductor Specialists. Figures released by the organisation show sales of industrial semiconductors through distribution channels in Q4 2015 grew by 11.3% to €1.75billion, compared to Q4 2014, while sales in 2015 reached €7.3bn, 14.6% higher than in 2014.

SoCs for 3D instrument clusters

The first family in a range of SoCs intended to support 3D instrument clusters has been launched by Renesas. The R-Car D1 Series is intended to provide a smooth migration path for automotive system manufacturers as the use of colour LCD panels in instrument cluster systems becomes more widespread.

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