All Latest Electronics News

Motion tracking modules for volume apps

Motion tracking technology specialist Xsens, the Fairchild subsidiary, has released a series of self-contained 3D motion tracking modules for high volume industrial and 'prosumer' applications. The parts are said to be suitable for use in attitude and heading reference systems, vertical reference units and inertial measurement units

Nordic products now distributed by Silica

Silica has signed a distribution agreement with Nordic Semiconductor. The agreement authorises Silica to sell and support the full range of ultra low power wireless solutions available from Nordic across Europe.

Semiconductor IP revenues drive EDA sector forward

Revenues for EDA products and services grew by 7.5% in Q1 2015 to $1.877billion, compared to $1.746bn in Q1 2014. And, according to the EDA Consortium, the moving average – which compares the most recent four quarters to the prior four quarters – increased by 8%.

Omnidirectional wireless charging system works over 50cm

Researchers at Korea Advanced Institute of Science and Technology (KAIST) claim to have developed a wireless-power transfer (WPT) system that allows mobile devices to be charged at any location and in any direction, even if the devices are away from the power source, just as Wi-Fi works for Internet connections.

New standard in EMC testing

RN Electronics has become one of the first Test Houses in the UK to be UKAS accredited to EN55032 (CISPR32), the new standard for electronics described as Multimedia Equipment (MME). EMC (electromagnetic) testing is already taking place on a range of professional audio equipments to the new standard.

Terahertz sensor enables detection of hidden objects

Scientists at the University of Warwick have developed the 'Q-Eye', a sensor that is said to be much faster than competing technologies used to detect and identify hidden objects. The invention senses radiation across the terahertz band of the electromagnetic spectrum, just between the infrared and microwave bands.

Toshiba develops process technologies

Toshiba has announced a method of embedding flash memory based on 65nm logic process that uses less power than current mainstream technology, and a single-poly non-volatile memory (NVM) process based on 130nm logic and analogue power. Applying the optimal process to various applications will allow Toshiba to expand its product line-up in such areas as microcontrollers, wireless communication ICs, motor controller drivers and power supply ICs.

Spinning a yarn when it comes to powering wearable electronics

Researchers at MIT and the University of British Columbia claim to have found a promising new approach to delivering the short, but intense, bursts of power needed by wearable electronic devices. The trick, they say, is to use yarns made from niobium nanowires 140nm in diameter as the electrodes in tiny supercapacitors – pairs of nanowires with an insulator between them.

Many-core computing power for automated driving

The AMALTHEA4public project is attempting to develop more powerful computers and complex software for autonomous vehicles to help them become more intelligent. The project, headed up by Bosch, comprises a team of 21 international technology specialists looking to develop embedded systems with central processing units that work in parallel.

End-of-life support for Freescale MC68040 MPUs

Freescale has licensed Rochester Electronics to provide a continuing manufacturing solution for its MC68040 32bit microprocessor product family. The agreement between Freescale and Rochester provides customers of the legacy MPUs with access to a secure and reliable source of parts for continued product supply after Freescale announced the discontinuation of the devices.

Plasmon wakes can be controlled, claims Harvard team

Harvard researchers have created surface plasmon wakes on a metallic surface and claim they can be controlled and steered. The team believes their work could lead to new types of plasmonic couplers, as well as lenses that could create two dimensional holograms or focus light at the nanoscale.

Peregrine launches UltraCMOS11, moves to 300mm wafers

RF silicon on insulator (SOI) pioneer Peregrine Semiconductor has announced UltraCMOS 11, said to be the industry's first RF SOI technology available on 300mm wafers. By moving to 300mm wafers, the company says it is opening the door to new enhancements and advanced features in future generations of the UltraCMOS technology platform.

Setting cybersecurity standards

Cyber attacks are said to cost UK businesses £18billion in lost revenue and £16billion in increased IT spending per year as a result of breaches. This causes reputation and brand damage due to customer data loss and lost revenue due to down time. According to the Information Security Breaches Survey, put together by the Centre of Economics and business research for Veracode, 81% of large and 60% of small businesses in the UK suffered a cybersecurity breach in 2014.

Accelerating accessibility of silicon photonics

Imec has announced that it and its partners have completed a three-year programme to make a variety of silicon photonics technologies accessible for industry and academia worldwide. Within the ESSenTIAL programme, funded by the European Commission, imec has worked to develop advanced multi-project-wafer services (MPW) and packaging services for silicon photonics.

Altera joins the OPNFV Project

Altera has joined the Open Platform for NFV (OPNFV), a community-led, industry-supported, open-source reference platform for network function virtualisation (NFV). NFV uses IT technologies to virtualise entire classes of network node functions into building blocks that may be connected, or chained, to create communication services.

3D printing set to speed complex optical fibre production

University of Southampton researchers are to trial new techniques to produce optical fibre using additive manufacturing. This new way of making fibre could pave the way for more complex structures capable of unlocking applications in a range of industries, from biotechnology to aerospace and telecommunications.

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