All Latest Electronics News

Nexperia secures $800m to fund future growth plans

Nexperia has completed a refinancing of its current facilities with $800million equivalent of senior credit facilities. This includes a significant proportion of Revolving Credit facility. The proceeds will be used to refinance existing outstanding debt and for Capex expenditure to fund future growth.

Writing and deleting magnets with lasers

Scientists at the Helmholtz-Zentrum Dresden-Rossendorf (HZDR) together with colleagues from the Helmholtz-Zentrum Berlin (HZB) and the University of Virginia in Charlottesville, USA have found a way to write and delete magnets in an alloy using a laser beam.

UK and India agree tech partnership

The UK and India have agreed to an ambitious Tech Partnership that is expected to generate significant investment and support the creation of thousands of new jobs across the UK.

Army research rejuvenates older zinc batteries

A water-based zinc battery that is simultaneously powerful, rechargeable and intrinsically safe has been developed by army scientists, together with a team of researchers from the University of Maryland (UMD) and the National Institute of Standards and Technology.

Processing power beyond Moore’s Law

In 1965, businessman and computer scientist, Gordon Moore, observed that the number of transistors in a dense integrated circuit doubles approximately every 2 years, which means a doubling of computer processing power. The prediction was so accurate that this phenomenon was dubbed ‘Moore’s Law’.

From insulator to conductor in a flash

The demand for more data capacity has been a constant industry venture and the capacities current hard disks and storage chips have managed to attain are impressive. But, with the physical limitations of silicon-based computer technology, it’s becoming harder and harder to accomplish impressive speed gains.

Taking the human out of manufacturing

The Chomerics Division of the Parker Hannifin Corporation Engineered Materials Group, which specialises in the development and application of electrically conductive and thermal interface materials, has announced the extension of its integrated assembly services.

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