All Latest Electronics News

Magnetic sensor to measure 3D nuclear spin

Researchers from the Institute for Biomedical Engineering in Zurich are said to have succeeded in measuring changes in strong magnetic fields with unprecedented precision. The technique allows the direct measurement of all three dimensions of nuclear spin.

Dallas based researchers find TMDs could be used for transistors

While there has been widespread interest in using graphene in transistors, its lack of a band gap has stood in the way. Because of this, researchers have looked at the potential of similar materials. Now, physicists from the University of Texas at Dallas have discovered that the properties of some materials that could be harnessed for next-generation transistors and electronics.

RS to manufacture Raspberry Pi in Japan

RS Components says the Raspberry Pi 3 will also be manufactured in Japan under a local contract manufacturing arrangement. The move is intended to meet increasing demand for the platform from customers in the Asia Pacific region.

Technique to mass produce single layer chips

A team of Stanford researchers claim to have demonstrated how to manufacture atomically thin materials and electronics. Such thin materials would possess properties, including transparency and flexibility, which would enable electronic devices that wouldn’t be possible with silicon.

Keysight expands PXI portfolio

Keysight Technologies has launched three PXIe chassis with different sizes and performance characteristics. The new devices are: a 10 slot Gen 3 chassis for high performance, benchtop and R&D applications; a five slot Gen 1 chassis; and a redesigned 18 slot Gen 2 chassis, with improved power supply and features which improve system integration.

Collaboration to address epitaxial wafer production challenges

IQE has signed a collaboration agreement with Australian company BluGlass. Under the terms of the 15 month joint R&D agreement, the two companies will work together to develop technology for high quality III-N films deposited by Remote Plasma Chemical Vapour Deposition (RPCVD) on silicon and crystalline rare earth (cREO) on silicon templates.

Ice filled nanotubes could enable new applications

A team of MIT researchers has found that, when confined within carbon nanotubes, water can freeze solid – even at temperatures that would normally see it boiling. The team adds its work might lead to new applications – essentially, ice filled wires – that take advantage of the electrical and thermal properties of ice, while remaining stable at room temperature.

Graphene impregnated cotton for wearable devices

A method for depositing graphene based inks onto cotton, developed by by researchers from the University of Cambridge and Jiangnan University, could enable the creation flexible and wearable electronics without the use of expensive and toxic processing steps.

No signal loss in this optical system

A model of an optical system in which losses in waveguides are compensated by gain in signal amplitude has been calculated by scientists from the Institute for Theoretical and Applied Electromagnetics of the Russia Academy of Sciences, the All-Russia Research Institute of Automatics and Moscow Institute of Physics and Technology (MIPT).

For wearables, plastic holes are golden

A research team from the National Institute of Standards and Technology (NIST) has come up with a way to build safe, nontoxic gold wires onto flexible, thin plastic film. Their demonstration potentially opens the way for wearable electronic devices that monitor health.

Autumn Statement: R&D to get more funding

The Chancellor’s Autumn Statement announced the establishment of a new National Productivity Investment Fund (NPIF), targeted at housing, transport, digital communications and R&D. According to the statement, the NPIF will provide an additional £4.7billion by 2020-21 in R&D funding.

Crowdfunding campaign to make RISC-V based MCU

A group of students from Colombia has launched a crowdfunding campaign to enable the manufacture of an open source RISC-V based microcontroller. According to the team, the campaign is looking to raise $480,000 to take the device – called Open-V – into mass production at TSMC. The MCU is targeted at a 130nm process and plans call for a first run of 70,000.

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