All Latest Electronics News

IBM to invest $3billion in new IoT unit

IBM is to invest $3billion over the next four years to establish a new Internet of Things (IoT) unit. It will also build a cloud based open platform to help clients and ecosystem partners across industries better integrate real-time data from dispersed sources directly into business operations.

Micron, Intel sampling 256Gbit 3D flash parts

Micron Technology and Intel say a 256Gbit multilevel cell (MLC) version of their 3D NAND technology is now sampling, with a 384Gbit triple level cell (TLC) design to follow shortly. Initial production runs have started and both devices should be in full production by the end of 2015.

ESD selection feature added to online design tool

Circuit protection specialist Littelfuse has added an ESD option to its iDesign online simulation and product selection tool. Introduced in 2014 to assist in fuse selection, iDesign now helps circuit designers to select the best TVS Diode Arrays for their application.

Companion board launched for GIZMO 2 platform

Farmell element14 has unveiled the GIZMO Explorer board, said to be a companion board for the GIZMO 2 platform. The board includes features and peripherals that suit it to use in motor control, human machine interface and control system designs.

SRAM developer enters into development deal with imec

Sheffield based SRAM developer sureCore is to collaborate with Belgian research centre imec on low power SRAM IP. Under the agreement, sureCore will license some of imec's SRAM design IP, whilst imec will make what is called a 'participation' in sureCore, which will establish an office in Leuven.

Synopsys launches embedded vision processor IP cores

Synopsys has launched the first products in its DesignWare EV vision processor range. The EV52 and EV54 processors are programmable and configurable IP cores said to combine the flexibility of software solutions with the low cost and low power consumption of dedicated hardware.

MoS2's light emission properties boosted by factor of 12

While molybdenum disulphide's greatest asset is said to be its monolayer thickness, a research team from Northwestern University in the US claims this is also its biggest challenge. Because it is thin, it has little interaction with light and this limits its application in light emitting and absorbing applications.

Silicon telluride nanoribbons have potential in electronic devices

Researchers from Brown University in the US have developed a way to make nanoribbons and nanoplates from silicon telluride. The resulting materials are pure p-type semiconductors that have the potential to be used in a variety of electronic and optical devices. The team also notes the layered structure of the nanoribbons could allow them to take up lithium and magnesium, meaning they could be used to make electrodes for batteries.

TI claims lowest power Cortex-M4F based MCUs

Texas Instruments has launched an MCU range based on ARM's Cortex-M4F core. The MSP432 range is said to optimise performance without compromising power. According to the company, the MCUs consume 95µA/MHz in active mode and 850nA in standby.

MEMS market worth $9.45billion, says IHS

Demand for MEMS devices grew by 5.7% in 2014, according to market researcher IHS, which identified Bosch as the leading supplier of the technology in a market driven by Apple. Claiming the market in 2014 was worth $9.45billion, IHS said Bosch held 12% of sales, worth $1.17bn.

Arrow to distribute Snapdragon based development platforms

Arrow Electronics says it will distribute a development platform and system on modules based on Qualcomm's Snapdragon 600 processor. According to the company, this will enable companies addressing the embedded and industrial sectors to develop applications such as security systems, robotics and motion control.

NI boosts 5G presence with acquisition of BEEcube

Looking to boost its presence in 5G communications, National Instruments is acquiring BEEcube, a leading supplier of FPGA based prototyping and deployment products for advanced wireless research, wireless infrastructure and military/defence applications.

FD-SOI's proponents propose a detour around FinFETs

Those organisations trying to make fully depleted silicon on insulator (FD-SOI) technology a realistic alternative to FinFETs have sketched out a roadmap intended to broaden its appeal. Included is non volatile memory, better RF handling and a path to 7nm.

XMOS ships first xCore200

XMOS has announced the launch of the XCORE-200, a Gigabit Ethernet enabled family of multicore MCUs. The devices integrate 16 32bit RISC cores and are said to be the first 10/100/1000 Ethernet solutions which offer a programmable MAC layer and webserver support.

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