All Latest Electronics News

Power MOSFETs approach 'perfect' switching performance

STMicroelectronics (ST) has extended its MDmesh M2 series of N-channel power MOSFETs by introducing devices that are claimed to offer the industry's highest power efficiencies in power supplies for servers, laptops, telecom, and consumer applications. With these devices, designers can create switching power conversion solutions that are lighter and more compact.

Distribution deal adds Bluetooth modules to portfolio

Following an agreement with German company Stollman, Acal BFi will distribute the latter's Bluetooth modules. According to Acal, the German company has specialised in the development of Bluetooth and Bluetooth Low Energy modules for years and notes the modules can be quickly and cost-effectively integrated into a range of products.

Toshiba expands ARM Cortex-M-based MCU line-up

Toshiba Electronics Europe has announced it will enhance its portfolio of ARM Cortex-based microcontrollers (MCUs). The TXZ series of MCUs are said to support low-power consumption and high-speed operation for IoT and M2M ecosystems.

3D printed robotic hand wins James Dyson Award

Joel Gibbard, winner of the Young Engineer of the Year Award at last year's British Engineering Excellence Awards, has become the UK winner of the James Dyson Award for his prototype 3D printed hand. Gibbard claims the hand can be made faster and at lower cost than current artificial limbs.

Comfortable EEG headset achieves high signal quality

Imec, Holst Centre and the Industrial Design Engineering (IDE) faculty of Delft University of Technology (TU Delft) have announced the introduction of a wireless electroencephalogram (EEG) headset that can be worn comfortably and achieves a high-quality EEG signal. The headset is said to enable effective brain-computer interfacing and can monitor emotions and mood in daily life situations using a smartphone app.

European semi sales reach record in Q2 2015

DMASS, the Distributors' and Manufacturers' Association of Semiconductor Specialists, says sales of semiconductors through distribution channels in Q2/CY15 grew by 16% to reach €1.86billion, a record quarter, although a significant part of the increase is provided by exchange rates.

ams to build fab in New York State

Analogue and sensor specialist ams says it will create more than 1000 jobs and invest more than $2billion over the next 20 years to support the construction of a fab in New York state capable of running 200 and 300mm wafers. Construction is scheduled to begin in spring 2016.

Industry's smallest energy-friendly touch sensing MCU

Silicon Labs has introduced the latest member of its EFM8 eight-bit MCU portfolio designed for ultra-low-power, small-footprint IoT applications with capacitive touch sensing requirements. The EFM8SB1 Sleepy Bee MCUs, available in a 1.78 x 1.66 mm wafer-level chip-scale package, are claimed to be the industry's smallest MCUs.

Microchip expands PIC MCU series

Microchip has announced an expansion within its PIC32MX1/2 32-bit MCU family that features a 256KByte Flash configuration and 16KByte of RAM in small-footprint packages down to 6 x 6mm. These latest additions to its MCU family are said to provide flexibility to low-cost applications that need complex algorithms and application code, as well as software and tools for designs in graphics, touch sensing and general-purpose embedded control.

Quantum dot research lights the way

Advances in manufacturing technology for quantum dots at Oregon State University may lead to a new generation of LED lighting that produces a more user-friendly white light, while using less toxic materials and low-cost manufacturing processes that take advantage of simple microwave heating.

Atmel chooses Intel technology to provide more IoT security

Atmel says it is working with Intel to enable more secure IoT applications. As part of this approach, Atmel will support Intel's Enhanced Privacy ID (EPID) technology on its SmartConnect wireless solutions, a move which it says will improve mutual authentication of the IoT node with the cloud.

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