All Latest Electronics News

ams acquires NXP's advanced CMOS sensor business

Austrian sensor and analogue specialist ams has announced that it has acquired the CMOS Sensor Business from NXP Semiconductors. The move expands ams' environmental sensor portfolio with advanced monolithic and integrated devices to measure variables such as relative humidity, pressure and temperature.

Flextronics changes name to Flex

Flextronics has announced that it has officially changed its name to Flex, with a promise to help the world live smarter in what it is dubbing the 'Age of Intelligence'.

BEEAs 2015 entry deadline extended

Due to an overwhelming demand to extend the submission date for the British Engineering Excellence Awards (BEEAs) entries, Friday 7th August has been chosen as the new deadline for entries.

Silicon based device is sensitive to photon spin, say scientists

A research team from the University of Pennsylvania has demonstrated a silicon based photonic device that is sensitive to the spin of the photons in a laser shined on one of its electrodes. According to the team, light that is polarised clockwise causes current to flow in one direction, while anticlockwise polarised light makes it flow in the other direction.

ROHM acquires Powervation for $70m

ROHM has announced that it has completed the acquisition of Powervation for approximately $70million. The combination of Powervation's Intelligent Digital Power platform with ROHM's analogue power technology and global market access will enable the company to address a range of market opportunities in digital high density systems and ICs such as processors, memory, FPGAs, and ASICs.

Researchers produce 'building blocks' for ultrathin electronics

Researchers at the US Department of Energy's Oak Ridge National Laboratory (ORNL) have combined a novel synthesis process with commercial electron-beam lithography techniques to produce arrays of semiconductor junctions in arbitrary patterns within a 1nm-thick semiconductor crystal. This compares to the 10nm-thick crystals currently used in leading edge chips.

ARM puts in strong Q2 performance as customer base broadens

ARM's second quarter results show the company grew revenue by 15% in Dollars over the same period in 2014, and by 22% when stated in Sterling. The figures also showed that processor royalty revenues grew by 31% year on year and that 54 licences were signed in Q2, which the company says is a record.

Imagination joins the 5G Innovation Centre

Imagination Technologies has joined the 5G Innovation Centre (5GIC) at the University of Surrey to collaborate with leading companies in exploring, developing and defining underlying technologies that will power the next-generation 5G mobile communications network.

32bit delta-sigma A/D converters set to boost PLC performance

Texas Instruments has introduced two 32bit delta-sigma A/D converters that are said to combine high resolution, low noise and integrated fault detection. This combination, the company notes, eliminates many of the performance and features trade-offs typically associated with device evaluation and selection.

USB Type-C devices feature smallest footprint and lowest power

Fairchild has launched a portfolio of USB Type-C solutions that enable manufacturers to add the next generation of USB functionality to smartphones, computers, power adapters and other devices. Fairchild's USB Type-C solutions are claimed to help manufacturers develop thinner, sleeker devices that consume less system power for better energy efficiency.

Microchip adds two PIC MCU families to its portfolio

Microchip has announced two eight-bit families that expand its growing portfolio of PIC MCUs with Core-Independent Peripherals (CIPs). Eight-bit MCUs can be used in a broader range of applications, due to the growing number of these intelligent, interconnected CIPs that combine to perform functions autonomously, without the core.

3D printed 'smart cap' can sense spoiled food

Engineers at the University of California, in collaboration with colleagues at Taiwan's National Chiao Tung University, have integrated electrical components, such as resistors, inductors, capacitors and integrated wireless electrical sensing systems into the 3D printing process. They have put the new technology to the test by printing a wireless 'smart cap' for a milk carton that detects signs of spoilage using embedded sensors.

Government to fund testing of automated vehicles

As part of the £100million for research into intelligent mobility announced by the Chancellor in the Spring 2015 Budget, the government has launched a £20m competitive fund for collaborative research and development into driverless vehicles, along with a code of practice for testing.

TSMC plans to use EUV at 5nm, but may use it earlier

TSMC hasn't given up hope on using EUV lithography at the 10nm node, but it appears to be more likely to be introduced at the 5nm node. Speaking on a conference call, Mark Liu, TSMC's president and co-CEO, pictured, said: "We are planning to exercise EUV at 7nm and are currently planning to use EUV at 5nm. But it depends on certain development criteria and milestones."

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