03 December 2009

Compact COM Express module with superior graphics performance

congatec AG has announced the conga-CS45, a new COM Express compact module, available in January 2010.

The module features the Intel GS45 small form factor (SFF) chipset, which enables significant performance increases despite a smaller footprint and lower power consumption. The module is suitable for mobile applications which require high graphics performance such as portable ultrasound devices.

The module is said to offer true high end graphics performance which was unprecedented at such small dimensions until now. Even hardware implemented decompression for hdtv videos is already integrated in the chipset. In addition, the module offers a choice of graphics interfaces ranging from sdvo, dvi and hdmi to DisplayPort.

The conga-CS45 is equipped with the latest generation of 45nm Intel processors including the Intel Celeron ULV722 with a mere 5.5W thermal dissipation power or the Intel Core 2 Duo SP9300 with 25W TDP as well as 6MB storage capacity and clock speed of 2.3GHz.

The conga-CS45 can be upgraded to 4GB of ddr3 memory with 1067MHz. Compared to ddr2 memory, ddr3 technology requires approximately 20% less power. The module has three serial ATA connectors with RAID support and it also offers optional support of Intel Active Management Technology which enables remote control via Ethernet or Internet even before starting the operating system.

To meet the special needs of mobile applications the conga-CS45 permits Core Sleep States C0 to C6 which congatec says makes it easy to optimise the power requirements for each scenario.

The conga-CS45 is available for mass production as of January 2010.

Author
Chris Shaw

Supporting Information

Websites
http://www.congatec.com

Companies
congatec AG

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