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Time-of-Flight 3D vision solution

A time-of-flight (ToF) chipset and development kit from Melexis is said to enable simple, modular and future proof design of 3D vision solutions. Previously available only as part of a development system, the chipset is now available to designers everywhere.

The chipset includes the MLX75023 optical format ToF sensor and the MLX75123 companion IC that embeds many of the external components normally required to develop a 3D vision solution.

With this high level of integration, the company claims designers no longer have to be concerned with external FPGAs and A/D controllers.

The ToF sensor is said to offer the smallest pixel at QVGA resolution with 63dB linear dynamic range and sunlight robustness, thanks to the company’s advanced pixel technology. The MLX75123 companion chip directly interfaces the sensor IC to a host MCU and provides rapid readout of data from the sensor.

The modular approach taken in designing the chipset means that the sensor can be changed or upgraded without having to change the product architecture. This allows the design of multiple solutions with the same base design as well as rapid implementation of new sensors as they reach the market.

Typical applications for the chipset include gesture recognition, driver monitoring and occupant detection in automotive applications. Other applications include conveyer belts, robotics and volume measurement as well as people counting and security.

The chipset is available in both automotive and industrial grades, for temperatures ranging from -40 to 105°C and -20 to 85°C respectively.

Author
Peggy Lee

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