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Sliver straddle-mount connectors enable a faceplate-pluggable OCP NIC 3.0

TE Connectivity (TE), has introduced its new Sliver straddle-mount connectors, which are the new standard form factor supporting a faceplate-pluggable Open Compute Project (OCP) NIC 3.0.

A new extension of the Sliver product line, these straddle-mount connectors were designed to be useful for OCP NIC 3.0 cards in a low profile for ease of system maintenance and improved thermal management.

Sliver straddle-mount connectors for SFF-TA-1002 support high speeds through PCIe Gen 5, with a roadmap to 112G. SFF-TA-1002 is a proposed alternative or replacement to many form factors, including M.2, U.2, and PCIe. The high-density, 0.6mm pitch of the Sliver straddle-mount connectors also supports next-gen silicon PCIe lane counts, which is where current products in the market begin to max out.

OCP NIC 3.0 cards are horizontal and faceplate-pluggable, which helps to increase airflow through the enclosure and enable system ease of design.

TE’s Sliver straddle-mount products are said to be among the most cost-effective and highest performing solutions on the market.

Author
Neil Tyler

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http://www.te.com

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TE Connectivity

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