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Single package SSDs with 64-layer 3D flash memory

The BG3 series from Toshiba Electronics Europe is a single-package ball grid array (BGA) solid state drive (SSD) product line based on the company’s latest 64 layer, 3-bit-per-cell TLC BiCS FLASH.

Designed for future mobile devices, the BG3 SSDs are said to deliver faster sequential read/write transfer speeds and a smaller footprint than traditional SATA-based drives.

Featuring a DRAM-less design, the company claims the BG3 series consumes a fraction of the power requirement of other NVM Express whilst measuring 1.3mm high.

According to the company, the BG3 series leverages the Host Memory Buffer (HMB) feature in NVMe Revision 1.2.1 to maintain high performance without integrated DRAM by using host memory for flash management purposes.

Featuring a PCI Express Gen3 x2 lane and NVMe Revision 1.2.1 architecture, the SSD delivers up to 1520MB/s sequential read and up to 840 MB/s sequential write, which the company claims are respectively 2.7 and 1.5 times the theoretical maximum bandwidth of SATA 6Gbit/s.

Additionally, BG3 also features SLC cache to accelerate burst type workloads, such as those routinely experienced on Windows-based PCs.

Available in 128GB, 256GB, and 512GB capacities, the SSDS can come in a surface-mount BGA (M.2 1620) or a removable module (M.2 2230) form factor for platform design flexibility.

To address modern security needs, self-encrypting drive options with Trusted Computing Group Opal Version 2.01 are available.

Author
Peggy Lee

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