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Renesas looks to accelerate sensor network gateway design

Renesas has introduced am IO-Link master development kit to accelerate IO-Link-based application development for industrial networked devices in the smart factory.

The development kit includes a board and pre-qualified sample software provided by TMG. The board has eight IO-Link connecters allowing developers to immediately connect IO-Link slave devices and start the evaluation process. The development kit has been designed to be easy to use and contributes to shorter prototype-to-production process time and helps to reduce the development burden for engineers.

The solution is supported by two CPUs that operate independently and simultaneously with a large built-in SRAM. The eight-port IO-Link Master is controlled by one CPU; the other CPU features an R-IN engine architecture and supports Industrial Ethernet communication to the upper layers, such as PLC, without any external microcontroller, microprocessor, or memory like DDR. Integrating the two CPUs in a small 12mm x 12mm LFBGA package also helps with designing compact PCBs.

Key Features

Strong development environment reduces the system evaluation period by up to six months

  • All-in-one development kit makes it easy for users to begin evaluation immediately and accelerate their time to market.
  • The board offers rapid prototyping with eight-port IO-Link connectivity and connections to any IO-Link slave device.
  • Pre-qualified sample software from partner TMG shortens the traditional time required to move from prototype to mass production.

OptimiSed design for limited space and industrial environments

  • 6 MB of on-chip SRAM eliminates the need for external memory.
  • Small 12mm x 12mm LFBGA package makes the master solution ideally suited for printed circuit boards in space-constrained industrial applications.

Author
Neil Tyler

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