12 February 2013 Photocoupler reduces mounting area by 50% Toshiba's new photocoupler, the TLP152, is designed to reduce pcb space and power consumption in igbt and mosfet designs that need galvanic isolation. The module works by directly driving igbts and mosfets without the need for additional components. Target applications include factory automation equipment, motor drives, digital home appliances and photovoltaic power micro inverters. A miniature S06 package is said to reduce mounting area by 50% compared to SDIP packaged devices. In addition, by lowering minimum supply voltage to 10V, Toshiba says the TLP152also helps to reduce power consumption. The module has a maximum propagation delay of 200ns. Construction is based around a GaAlAs infrared led optically coupled to an integrated high gain, high speed photodetector ic. Author Laura Hopperton Comment on this article Websites http://www.toshiba-components.com Companies Toshiba Electronics Europe GmbH This material is protected by Findlay Media copyright See Terms and Conditions. One-off usage is permitted but bulk copying is not. For multiple copies contact the sales team. Enjoy this story? People who read this article also read... NIDays 2013 NIDays is a technical conference designed specifically for ... Read Article Southern Manufacturing This year, Southern Manufacturing and Electronics is set to be ... Read Article Claire Jeffreys, NEW Claire Jeffreys, events director, National Electronics Week, ... Read Article Remotely access up to 16 ... Lantronix is set to launch its latest evolution device/terminal ... Read Article What you think about this article: Add your comments Name Email Comments Your comments/feedback may be edited prior to publishing. Not all entries will be published. Please view our Terms and Conditions before leaving a comment.