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Molex Nano-Pitch I/O 8X interconnect increases port density and speed

Molex has expanded its Nano-Pitch I/O Interconnect System portfolio with the addition of 8X cables and XD (eXtra Durable) vertical board mounted connectors.

Delivering data speed rates of 25 Gbps per lane, the Nano-Pitch I/O 8X Interconnect System offers increased port density and multi-protocol support to internal storage, server and mobile/enterprise applications. The XD board receptacles are offered as both 4X and 8X and use 4 through-hole pins for maximum robustness.

Providing enhanced data speed and signal integrity in an extremely compact form factor, the multi-protocol Nano-Pitch I/O Interconnect System is compatible with all known SAS, SATA and PCIe protocols, including PCIe Gen 4 (16 GT/s) and SAS 4 (24 Gbps). The system features a flexible pinout concept (continuous Ground-Signal-Signal-Ground) optimised for high-speed applications and maximising the number of high-speed lanes within the lengths provided. Eight lanes (8X) are available, per industry standard.

The small form factor (5mm × 23mm × 9mm) and a 12mm mated connector-to-cable assembly height for right angle cable exit allow the Nano-Pitch I/O System to meet the 14.47mm height for components on PCIe add-in cards. This makes it suitable for systems servicing mobile devices through enterprise applications. Staggered, reliable and constant dual-row contact configuration delivers hot pluggability, which allow components to be added without shutting down the server or router. Also, the connector provides optimal routing for high-speed trace connections while reducing the need for PCB real estate.

Storage systems applications for the Nano-Pitch I/O Interconnect System include data centre and enterprise storage systems, storage racks, JBODs, storage controllers, HBA servers and RAIDS. Telecommunications/networking applications for the connector include hubs, servers, switches and routers.

Author
Neil Tyler

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http://www.molex.com

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Molex

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