08/05/2018
Vayyar Imaging has announced the launch of what it is calling the “world’s most advanced” System on a Chip (SoC) for mmWave 3D imaging that integrates an unprecedented number of transceivers and an advanced DSP to create a high-resolution contour with high accuracy.
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21/03/2018
Arrow Electronics has extended its Arrow Renesas IoT Synergy (ARIS) platform for developing IoT devices with the ARIS-EDGE-S3.
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08/02/2018
A dual 10A or single 20A output, step-down µModule point-of-load regulator from 5V or 12V input supply rails has been announced by Analog Devices.
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31/01/2018
Two fully encapsulated digital DC/DC PMBus power modules have been announced by Renesas Electronics, which it claims deliver the highest power density and efficiency in their class.
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18/01/2018
An integrated point-of-load (IPOL) family from Infineon Technologies is said to combine high power density with ease of use.
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18/01/2018
Xilinx has announced the availability of the automotive qualified Zynq UltraScale+ MPSoC family, enabling the development of safety critical ADAS and Autonomous Driving Systems.
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05/12/2017
Allegro MicroSystems Europe has introduced 0° to 360° angle sensor ICs that are able to provide contactless high-resolution angular position information based on magnetic Circular Vertical Hall (CVH) technology.
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10/11/2017
Samtec has release of the two new VITA 57.4-compliant FMC+ loopback cards. The devices are said to provide FPGA designers with easy to use loopback options for testing low and high speed transceivers on any FPGA development board or carrier card.
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06/11/2017
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Silicon Labs has released multiprotocol software for its Wireless Gecko system-on-chip (SoC) and module portfolio, that will enable simultaneous operation of Zigbee and Bluetooth low energy (LE) on a single SoC bringing together the key application benefits of both protocols.
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06/11/2017
Infineon Technologies has launched the IRPS5401, a five output Point of Load (POL) digital voltage regulator for FPGAs, ASICs, and other multi-rail power systems.
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04/09/2017
Mouser Electronics has started shipping the MachXO3-9400 development board from Lattice Semiconductor.
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02/05/2017
FTDI Chip has introduced a pair of hardware modules to complement its FT602 USB 3.1 (Gen 1) video class FIFO IC, which has now gone into full scale production.
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24/04/2017
The latest version of Microsemi’s Libero SoC software – version 11.8, a comprehensive suite of FPGA design tools – has been released. In addition to the software release, which includes enhancements such as mixed language simulation, debugging capabilities and a new netlist viewer, the company is also introducing a free evaluation license enabling users to evaluate the company’s flash-based FPGAs and SoC FPGAs.
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09/01/2017
ZestDAQ from Orange Tree Technologies is a software platform for data acquisition and control applications running on the company’s Zest series of USB and Gigabit Ethernet interconnect boards.
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30/11/2016
The OKDL-T/60-W12 from Murata is a 60A, 95 % efficient addition to the OKD family of digitally controlled point of load (PoL) DC/DC converters. The power module is suited for FPGA and processor applications in networking, computing, and telecom systems.
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14/11/2016
Socionext, a supplier of SoC-based solutions, has introduced a new ARM-based multi-core processor. The ‘SC2A11A’ SoC Integrates 24 cores of ARM Cortex-A53 on a single die, and is intended to address the needs of growing applications such as data centre servers for online service providers and edge computing in IoT (Internet of Things) systems.
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12/10/2016
Murata has developed a series of miniature “Mono Block” type surface mount point-of-load (PoL) DC-DC converters. The MYMGK series of non-isolated “Mono Block” type converters are available in two models, a 6 Amp and a 20 Amp.
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22/09/2016
SmartBond DA14681, an integrated single chip solution from Dialog Semiconductor, is claimed to provide connectivity for rechargeable devices, including wearables, smart home and other IoT devices.
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11/03/2016
Microsemi has released version 11.7 of its Libero system-on-chip (SoC), a suite of FPGA design tools used with the company’s FPGA products. The release includes a number of new features to enhance ease-of-use and efficiency for designers, as well as security and evaluation tools, for its RTG4 FPGAs, SmartFusion2 SoC FPGAs and IGLOO2 FPGAs, speeding time to market for designers.
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24/02/2016
Cypress Semiconductor has introduced a series from its PSoC 4 programmable system-on-chip architecture that completes its platform for the migration of 8- and 16-bit MCU-based embedded systems to 32-bit ARM platforms. The PSoC 4 S-Series devices are suitable for a range of industrial systems, wearables, and consumer applications.
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23/02/2016
AMD has announced its 3rd Generation AMD Embedded G-Series SoCs and the Embedded G-Series LX SoC. The latest offerings are said to expand designers’ ability to scale x86 platforms, starting with the entry-level AMD Embedded G-Series LX SoC. Also announced are two 3rd Generation AMD Embedded G-Series SoCs, codenamed ‘Prairie Falcon’ and ‘Brown Falcon’, which introduce pin compatibility for G-Series processors with the higher performance AMD Embedded R-Series SoC.
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18/02/2016
Sundance Multiprocessor Technology has integrated Xilinx’s SDSoC development environment on to its EMC2-Z7030 single board computer (SBC). Sundance’s EMC2 range is an industrial-grade and deployment-ready SBC that features a Xilinx Zynq SoC with integrated dual-core ARM-A9 CPUs coupled to 1Gbyte of DDR3 memory, four-lanes of PCI-Express and re-programmable logic with Kintex-7 FPGA technology.
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19/11/2015
Xilinx has released the Spartan-7; an FPGA range that it claims will deliver I/O intensive devices for cost-sensitive applications. The range is suitable for use in automotive, consumer, industrial IoT, data centre, wired and wireless communications, and portable medical applications.
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05/11/2015
PNI Sensor has introduced the latest in its sensor fusion product range: SENtral-A2, an ultra-low power coprocessor that is claimed to offer the most expansive algorithm feature set and development framework of any product of its kind.
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27/10/2015
Lattice Semiconductor has announced that their MachXO3 family of devices now supports 900 Mbps per lane operation for MIPI D-PHY interfaces. This has been enabled by the latest Lattice Diamond 3.6 design tool suite software update. MachXO3 devices can now be used to bridge a wide variety of image sensors & displays with MIPI D-PHY, CSI-2 or DSI interfaces at speeds of up to 900 Mbps.
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