08/08/2018
Microsemi Corporation has launched its SXP 24G family of devices, what it claims is the industry’s first 24G SAS (SAS-4) expanders for server and networked storage.
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24/07/2018
Toshiba Memory Europe has developed a prototype sample of a 96-layer BiCS FLASH, memory device using its proprietary 3D flash quad level cell (QLC) technology that has been able to boost single-chip memory capacity to the highest level yet achieved.
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27/06/2018
Fujitsu has introduced a new FRAM product with a storage density of 8 Mbit. The MB85R8M2T is intended for use in industrial automation and financial logging systems, where a high data throughput is required, and the integrity of the data is essential.
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12/06/2018
Solid State Supplies is offering a range of memory products from SMART Modular Technologies.
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08/06/2018
NVM Express (NVMe) is already making a big splash in the enterprise and consumer markets. But some are now asking whether this ultra-fast solid state drive (SSD) protocol might also have a future within the embedded domain.
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01/06/2018
Toshiba Memory Europe (TME) has launched its XS700 Series of portable solid state drives (SSDs).
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31/05/2018
Cypress Semiconductor has announced the Semper NOR Flash memory family which it claims delivers the industry’s best combination of safety and reliability for automotive and industrial applications.
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09/05/2018
Alliance Memory, a manufacturer of hard-to-find SRAM, DRAM, and SDRAM ICs, has expanded its SDRAM portfolio which now features a wide variety of components that combine low power consumption with power-saving features to extend battery life in mobile devices.
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23/03/2018
Toshiba Memory Europe has extended its portfolio of solid-state drives (SSDs) targeting data centres, with a new line-up of 3D flash memory-based PCI Express NVMe and SATA SSDs in multiple form factors.
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02/03/2018
In order to boost storage capabilities, Bridgtek has unveiled a range of embedded video engine (EVE) graphics controllers with adaptive scalable texture compression (ASTC) functionality at Embedded World 2018.
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09/02/2018
Distributor, RS Components (RS), is stocking the SSD 860 range of solid-state drives from Samsung.
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18/01/2018
A 2.4GHz 802.11b/g/n fully embedded standalone Wi-Fi module has been launched by Panasonic Industry Europe, which it says is for highly integrated and cost-effective applications.
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15/01/2018
We are now beginning to see the emergence of a range of technologies that will lead to major changes in the design of real-time embedded systems. These technologies include the Internet of Things (IoT), artificial intelligence (AI) and augmented reality (AR). The unifying thread between all of them is a greater focus on the use of distributed systems coupled with a need for high performance to deal with the data they generate and consume.
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11/01/2018
With a package size of 6.5mm x 6.5mm x 1.4mm and requiring just 51mm2 of PCB area, Solid State Supplies claims it has created the world’s smallest Bluetooth low energy, system in package (SiP) module.
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12/12/2017
Toshiba Memory Europe has begun sample shipments of embedded NAND flash memory products for automotive applications that are compliant with JEDEC UFS version 2.1.
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09/11/2017
A single wire, two pin EEPROM from Microchip operates from a supply ranging from 2.7V to 4.5V, allowing it to operate in conjunction with systems powered by Li-ion batteries.
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05/09/2017
Microchip is making available a new 1.8V Serial Quad I/O SuperFlash memory device. The SST26WF064C, a low-voltage 64-Megabit device, combines Dual Transfer Rate (DTR) with proprietary SuperFlash NOR Flash technology, making it suitable for wireless and battery-powered applications.
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04/08/2017
The BG3 series from Toshiba Electronics Europe is a single-package ball grid array (BGA) solid state drive (SSD) product line based on the company’s latest 64 layer, 3-bit-per-cell TLC BiCS FLASH.
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23/03/2017
ATEK Access Technologies has announced it has expanded its Datakey RUGGEDrive Line of USB flash drive and SD memory tokens with a new line of industrial models, providing industrial SD card functionality in the unique RUGGEDrive form factor.
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30/01/2017
Cypress has added 64Mbit and 128Mbit devices to its family of NOR flash memories. Featuring a Quad Serial Peripheral Interface, the FL-L NOR parts are said to provide reliability and security for high-performance embedded systems such as ADAS, automotive clusters, industrial control and smart factory equipment.
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21/12/2016
Toshiba has announced the JEDEC e·MMCTM Version 5.1 compliant embedded NAND flash memory products supporting AEC-Q100 Grade2 requirements. The line up offers densities of 8GB, 16GB, 32GB and 64GB.
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25/10/2016
Toshiba Electronics Europe has launched the e•MMC and UFS NAND flash embedded memories that have been designed to use enhanced integrated controller technologies to deliver significant read and write speed improvements when used in demanding applications.
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19/10/2016
A low cost, low risk memory solution from Microchip is said to offer unlimited endurance and safe data storage at power loss. Called EERAM, the device is a standalone SRAM with a shadow EEPROM back-up that retains the SRAM’s contents when system power is lost.
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03/10/2016
Texas Instruments (TI) has introduced what is said to be the industry’s first fully integrated power management solution for DDR2, DDR3 and DDR3L memory subsystems in automotive and industrial applications.
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08/07/2016
A high-speed, self-refresh DRAM based on Cypress’ low pin count HyperBus interface is now sampling.
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