14/03/2019
Toshiba Memory Europe has announced that its KumoScale shared accelerated storage software can now support TCP (Transmission Control Protocol) transport in its 3.9 production release.
|
|
|
28/02/2019
Toshiba Memory Europe has announced that the newly released PM5 Series of 12Gb/s enterprise SAS SSDs has earned VMware vSAN 6.7 certification.
|
|
|
26/02/2019
Renesas has announced what it says is the world’s first microcontroller (MCU) with embedded flash that integrates a hardware-based virtualisation-assisted function while maintaining the fast, real-time performance of the RH850 products.
|
|
|
12/02/2019
Hyperstone has introduced the X1 – SATA III SSD controller to meet industrial requirements and targets high-reliability and low power SSDs, M.2 and U.2 modules, CFast cards and system-in-package eSSDs or discrete on-board flash drive integration.
|
|
|
07/12/2018
Toshiba Electronics Europe is adding 12TB and 14TB models to both its N300 NAS Hard Drive and X300 Performance Hard Drive series.
|
|
|
29/10/2018
Alliance Memory has introduced a family of high-speed CMOS pseudo SRAMs (PSRAMs) with densities from 8Mb to 128Mb in 6.0 mm x 7.0 mm x 1.0 mm 48-ball FPBGA and 4.0 mm by 4.0 mm by 1.0 mm 49-ball FPBGA packages.
|
|
|
02/10/2018
Diodes announced the introduction of the AP22815 and AP22615 3A single-channel high-side power switches for USB ports and other hot-swap applications.
|
|
|
08/08/2018
Microsemi Corporation has launched its SXP 24G family of devices, what it claims is the industry’s first 24G SAS (SAS-4) expanders for server and networked storage.
|
|
|
24/07/2018
Toshiba Memory Europe has developed a prototype sample of a 96-layer BiCS FLASH, memory device using its proprietary 3D flash quad level cell (QLC) technology that has been able to boost single-chip memory capacity to the highest level yet achieved.
|
|
|
27/06/2018
Fujitsu has introduced a new FRAM product with a storage density of 8 Mbit. The MB85R8M2T is intended for use in industrial automation and financial logging systems, where a high data throughput is required, and the integrity of the data is essential.
|
|
|
12/06/2018
Solid State Supplies is offering a range of memory products from SMART Modular Technologies.
|
|
|
08/06/2018
NVM Express (NVMe) is already making a big splash in the enterprise and consumer markets. But some are now asking whether this ultra-fast solid state drive (SSD) protocol might also have a future within the embedded domain.
|
|
|
01/06/2018
Toshiba Memory Europe (TME) has launched its XS700 Series of portable solid state drives (SSDs).
|
|
|
31/05/2018
Cypress Semiconductor has announced the Semper NOR Flash memory family which it claims delivers the industry’s best combination of safety and reliability for automotive and industrial applications.
|
|
|
09/05/2018
Alliance Memory, a manufacturer of hard-to-find SRAM, DRAM, and SDRAM ICs, has expanded its SDRAM portfolio which now features a wide variety of components that combine low power consumption with power-saving features to extend battery life in mobile devices.
|
|
|
23/03/2018
Toshiba Memory Europe has extended its portfolio of solid-state drives (SSDs) targeting data centres, with a new line-up of 3D flash memory-based PCI Express NVMe and SATA SSDs in multiple form factors.
|
|
|
02/03/2018
In order to boost storage capabilities, Bridgtek has unveiled a range of embedded video engine (EVE) graphics controllers with adaptive scalable texture compression (ASTC) functionality at Embedded World 2018.
|
|
|
09/02/2018
Distributor, RS Components (RS), is stocking the SSD 860 range of solid-state drives from Samsung.
|
|
|
18/01/2018
A 2.4GHz 802.11b/g/n fully embedded standalone Wi-Fi module has been launched by Panasonic Industry Europe, which it says is for highly integrated and cost-effective applications.
|
|
|
15/01/2018
We are now beginning to see the emergence of a range of technologies that will lead to major changes in the design of real-time embedded systems. These technologies include the Internet of Things (IoT), artificial intelligence (AI) and augmented reality (AR). The unifying thread between all of them is a greater focus on the use of distributed systems coupled with a need for high performance to deal with the data they generate and consume.
|
|
|
11/01/2018
With a package size of 6.5mm x 6.5mm x 1.4mm and requiring just 51mm2 of PCB area, Solid State Supplies claims it has created the world’s smallest Bluetooth low energy, system in package (SiP) module.
|
|
|
12/12/2017
Toshiba Memory Europe has begun sample shipments of embedded NAND flash memory products for automotive applications that are compliant with JEDEC UFS version 2.1.
|
|
|
09/11/2017
A single wire, two pin EEPROM from Microchip operates from a supply ranging from 2.7V to 4.5V, allowing it to operate in conjunction with systems powered by Li-ion batteries.
|
|
|
05/09/2017
Microchip is making available a new 1.8V Serial Quad I/O SuperFlash memory device. The SST26WF064C, a low-voltage 64-Megabit device, combines Dual Transfer Rate (DTR) with proprietary SuperFlash NOR Flash technology, making it suitable for wireless and battery-powered applications.
|
|
|
04/08/2017
The BG3 series from Toshiba Electronics Europe is a single-package ball grid array (BGA) solid state drive (SSD) product line based on the company’s latest 64 layer, 3-bit-per-cell TLC BiCS FLASH.
|