08/08/2018
Microsemi Corporation has launched its SXP 24G family of devices, what it claims is the industry’s first 24G SAS (SAS-4) expanders for server and networked storage.
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24/07/2018
Toshiba Memory Europe has developed a prototype sample of a 96-layer BiCS FLASH, memory device using its proprietary 3D flash quad level cell (QLC) technology that has been able to boost single-chip memory capacity to the highest level yet achieved.
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27/06/2018
Fujitsu has introduced a new FRAM product with a storage density of 8 Mbit. The MB85R8M2T is intended for use in industrial automation and financial logging systems, where a high data throughput is required, and the integrity of the data is essential.
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12/06/2018
Solid State Supplies is offering a range of memory products from SMART Modular Technologies.
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08/06/2018
NVM Express (NVMe) is already making a big splash in the enterprise and consumer markets. But some are now asking whether this ultra-fast solid state drive (SSD) protocol might also have a future within the embedded domain.
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01/06/2018
Toshiba Memory Europe (TME) has launched its XS700 Series of portable solid state drives (SSDs).
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31/05/2018
Cypress Semiconductor has announced the Semper NOR Flash memory family which it claims delivers the industry’s best combination of safety and reliability for automotive and industrial applications.
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21/05/2018
A 2D Touch Surface library from Microchip Technology is said to enable designers to easily implement touch pads using the company’s 8-bit PIC and AVR microcontrollers (MCUs) and 32-bit SAM MCUs.
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09/05/2018
Alliance Memory, a manufacturer of hard-to-find SRAM, DRAM, and SDRAM ICs, has expanded its SDRAM portfolio which now features a wide variety of components that combine low power consumption with power-saving features to extend battery life in mobile devices.
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08/05/2018
Consolidating secure boot, secure firmware update, and secure-engine services in a STM32Cube expansion software package, X-CUBE-SBSFU v.2.0 from STMicroelectronics is designed to help product developers fully utilise the security features of STM32 microcontrollers to protect connected devices like IoT endpoints and help manage their life-cycle.
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03/04/2018
congatec has introduced the conga-TS370 COM Express Type 6 Computer-on-Modules in parallel with the launch of the 8th Generation Embedded Intel Xeon and Intel Core processors (Coffee Lake H).
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27/03/2018
Marvell says it has achieved an industry first, with the release of its 88Q5050 secure automotive Ethernet switch which is integrated into the NVIDIA DRIVE Pegasus platform for autonomous vehicles.
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23/03/2018
Toshiba Memory Europe has extended its portfolio of solid-state drives (SSDs) targeting data centres, with a new line-up of 3D flash memory-based PCI Express NVMe and SATA SSDs in multiple form factors.
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02/03/2018
The Archer Kontrol family of board-to-board connectors was showcased by Harwin at this year’s Embedded World, designed to provide engineers with a robust, yet flexible interconnect solution for industrial tasks.
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02/03/2018
‘What originally took 3 to 4 hours to do, now takes seconds’, is the message Altium gave at Embedded World.
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02/03/2018
Farnell showcased a range of new services for design engineers at this year's Embedded World.
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02/03/2018
In order to boost storage capabilities, Bridgtek has unveiled a range of embedded video engine (EVE) graphics controllers with adaptive scalable texture compression (ASTC) functionality at Embedded World 2018.
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02/03/2018
HCC Embedded introduced two MISRA-compliant products at this year's Embedded World.
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09/02/2018
Distributor, RS Components (RS), is stocking the SSD 860 range of solid-state drives from Samsung.
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31/01/2018
A USB-based Bluetooth development platform based around Toshiba Electronics Europe’s TC35678 BT 4.2 single-chip Bluetooth Low Energy (LE) controller has been announced.
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18/01/2018
A 2.4GHz 802.11b/g/n fully embedded standalone Wi-Fi module has been launched by Panasonic Industry Europe, which it says is for highly integrated and cost-effective applications.
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15/01/2018
We are now beginning to see the emergence of a range of technologies that will lead to major changes in the design of real-time embedded systems. These technologies include the Internet of Things (IoT), artificial intelligence (AI) and augmented reality (AR). The unifying thread between all of them is a greater focus on the use of distributed systems coupled with a need for high performance to deal with the data they generate and consume.
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11/01/2018
With a package size of 6.5mm x 6.5mm x 1.4mm and requiring just 51mm2 of PCB area, Solid State Supplies claims it has created the world’s smallest Bluetooth low energy, system in package (SiP) module.
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09/01/2018
Bosch Sensortec has launched its BMA400, a low power acceleration sensor for wearables and IoT applications.
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12/12/2017
Toshiba Memory Europe has begun sample shipments of embedded NAND flash memory products for automotive applications that are compliant with JEDEC UFS version 2.1.
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