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The conga-QA6 is a new mobile module from Congatec, featuring the new Intel Atom Processor E6xx series. It offers improved graphics performance and extended temperature range capabilities.

It is based on the Qseven mobile standard and is equipped with the Intel Platform Controller Hub EG20T. All components of this design are specified for an industrial temperature range of -40 to 85°C.

The module is optimised to enable all mobile applications, and has been developed to utilise the latest low power consuming technology to meet the demand for small form factors. It has a typical power consumption of less than 5W, is compact in size and has integrated functions for battery and ACPI 3.0 power management.

Features include fast serial differential interfaces, such as PCI Express and Serial ATA, but omits support for legacy interfaces like EIDE and PCI. In total it supports 6x USB 2.0, 2x SATA, 1x SDIO, 3x PCIe, LPC bus, I²C bus, Gigabit Ethernet, High Definition Audio, SPI and CAN bus interfaces. The CAN bus and SPI interfaces are new additions to the Qseven standard and aim to utilise previously unused pins.

As an option, up to 32gigabytes of robust onboard Flash memory can be provided via the SATA interface. Cheaper memory may be obtainable from SD-Cards, which can also be used with the flexible SDIO interface. Additionally, faster MMC 4.0 cards with a data transfer rate of up to 52megabytes per second can also be implemented because of the 8bit data width. The SDIO standard supports WLAN, Bluetooth and RFID, as well as others.

The conga-QA6 module offers processing speeds of 600MHz, 1.0GHz, 1.3GHz and 1.6GHz combined with 512K L2 cache and features up to 2gigabytes of onboard DDR2 memory.

All Congatec boards are equipped with the Congatec embedded BIOS. A board controller is also utilised and carries out part of the embedded BIOS extensions. The autonomy of x86 processors means that functions such as system monitoring, as well as the I²C bus, aim to be faster and more reliable, even when the system is in standby mode.

Random access memory (RAM) and graphics are embedded in the processor as specified by the new Intel architecture. The performance of the new embedded 3D capable graphics engine is said to have improved by 50% and uses a frame buffer of up to 256megabytes. The graphics support DirectX 9.0E and OpenGL 2.0, while video applications have the use of MPEG2 and MPEG4 decoders. Graphics output is available via either a 1x24Bit LVDS channel or an SDVO port. The module uses the 'DisplayID' VESA standard for the automatic recognition of connected flat panel displays.


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