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Prime Block designed for highest performance

Infineon Technologies has expanded its product portfolio of thyristor/diode modules.

The new Prime Block 50 mm modules feature solder bond technology and the 60 mm modules pressure contact technology. They have been designed for highest performance when the desired current exceeds 600 A for a 60 mm footprint or 330 A for a 50 mm footprint.

This avoids the paralleling of modules when this is not an option. Prime Block modules are intended for industrial AC and DC drives as well as for rectifiers and bypasses in UPS.

The modules have been optimised for better thermal resistance and higher operational temperatures to push their performance beyond the existing limits. As a result, they are able to achieve higher power densities while maintaining reliability. The pressure contact modules in general provide best-in-class blocking stability, the solder bond modules fully undergo an X-ray monitoring after the soldering process.

The variant in the 60 mm standard housing comes in the topologies thyristor/thyristor and thyristor/diode with a blocking voltage of either 1600 V or 2200 V and in current ratings from 700 A to 820 A.

The 50 mm standard housing variant is offered in the topologies thyristor/thyristor, thyristor/diode and diode/diode. Its blocking voltage stands at 1600 V, 1800 V and 2200 V, the modules supports current ratings of up to 390 A.

The 50 and 60 mm Prime Block family is now available.

Author
Neil Tyler

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