18 November 2009 Counterfdeit components and acoustic microscopy This white paper from Alter Technology Group considers how the encapsulants used by semiconductor manufacturers may be identified and changes or variations detected - and will look in detail at encapsulants, and the potential hazards to system reliability. The paper explains the principles of CSAM and illustrates how these are applied in nondestructive testing, failure analysis and how the CSAM compliments radiographic or x-ray inspection. The limitations of CSAM are also reviewed. The paper also describes the results of Alter UK's research to date into plastic encapsulants and suggests how this work may be taken forward in the fight against counterfeiters. Author John Jones Related Downloads 20788\WP Counterfeit Components and Acoustic Microscopy.pdf Comment on this article Websites http://www.altertechnology.com/ This material is protected by Findlay Media copyright See Terms and Conditions. One-off usage is permitted but bulk copying is not. For multiple copies contact the sales team. Enjoy this story? People who read this article also read... NIDays 2013 NIDays is a technical conference designed specifically for ... Read Article Southern Manufacturing This year, Southern Manufacturing and Electronics is set to be ... Read Article Claire Jeffreys, NEW Claire Jeffreys, events director, National Electronics Week, ... Read Article Raspberry Pi upgraded The Raspberry Pi has seen its first significant change, with the ... Read Article What you think about this article: Add your comments Name Email Comments Your comments/feedback may be edited prior to publishing. Not all entries will be published. Please view our Terms and Conditions before leaving a comment.