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All Electronics Whitepapers

Advanced power devices for slimmer PSUs

As power supplies for high volume products such as tvs and computers are required to meet ever tougher demands on form factor, efficiency and cost, power supply controllers must integrate more features in order to increase efficiency while minimising component count, pcb size, complexity and bom costs.

Unleashing BeagleBone Black

This whitepaper from Texas Instruments tells you how to make the most of BeagleBone Black, a credit card sized device powered by an ARM Cortex-A8 based TI Sitara AM335x processor running at 1GHz.

Mobile OS architecture trends

In this whitepaper, Intel describes its investigations in the trends of mobile OS architecture over the next decade by focusing on the major commonalities.

Efficiency standards for external power supplies

OEMs who design external power supplies into their products must continue to monitor the latest regulations to ensure that they are in compliance in each region their product is sold. The goal of this article is to provide an up to date summary of the most current regulations worldwide.

A better way to cloud

This whitepaper explores the factors around the shifts in cloud computing, and highlights the differences between traditional cloud computing and cloud computing based on embedded processing.

Vault driven electronics design

Using Altium Designer, Altium Vault Technology and a methodology that uses a vault centric approach to electronics design, you are able to design in a controlled way without loss of design freedom, with the assurance that you are using design 'building blocks' that are managed and approved for design use.

Fundamentals of signal integrity analysis

New to signal integrity analysis, or just need to brush up on the fundamentals? If so, this white paper is aimed at you. This white paper starts at the very basic, actually before the fundamentals, answering the question "What do I need to know?" The paper begins by identifying and analysing critical nets. Next, it discusses transmission lines and the problems that arise from the high frequency noise generated by rapid edge rate signals. Finally, impedance is reviewed and discussed in the context of impedance and signal integrity.

Advanced PCB Techniques: How to Use the Latest Technologies

As PCB designers get creative to continually amaze, the new techniques are disruptive to traditional PCB design and fabrication unless done well. This extra effort to make ever faster or thinner electronics is rewarded in dollars, as Apple has shown in a series of amazing designs. Here we will review the advanced PCB techniques of 3D packaging, HDI, and embedded actives, find a common thread to design challenges, and then identify a common ingredient in good solutions.

Advanced PCB Techniques: How to Use the Latest Technologies

Extra effort to make faster electronics is rewarded in dollars, as Apple has shown in their designs. Here we will review the advanced PCB techniques of 3D packaging, HDI, and embedded actives, find a common thread to design challenges, and then identify a common ingredient in good solutions.

Peak performance on demand

This whitepaper from congatec looks at the the third generation of Intel Core processors, which not only shrink the manufacturing process from 32 to 22nm, but also use a new technology with 3d tri gate transistors.

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