03 October 2011 TI’s New Space Saving Package As electronics continue to permeate into new areas of automotive, medical, and industrial applications, packaging finds itself in the forefront of enabling new features required for growth in these markets. The need to further customize packaging for such applications will play a much bigger role moving forward in order to enable device solutions that previously were not possible. Author Texas Instruments Comment on this article Websites http://www.ti.com/uqfn Companies Texas Instruments This material is protected by Findlay Media copyright See Terms and Conditions. One-off usage is permitted but bulk copying is not. For multiple copies contact the sales team. Enjoy this story? People who read this article also read... NIDays 2013 NIDays is a technical conference designed specifically for ... Read Article Southern Manufacturing This year, Southern Manufacturing and Electronics is set to be ... Read Article Claire Jeffreys, NEW Claire Jeffreys, events director, National Electronics Week, ... Read Article BEEAs 2010 shortlist announced Findlay Media has announced the shortlist for the 2010 British ... Read Article What you think about this article: Add your comments Name Email Comments Your comments/feedback may be edited prior to publishing. Not all entries will be published. Please view our Terms and Conditions before leaving a comment.