03 October 2011

TI’s New Space Saving Package

As electronics continue to permeate into new areas of automotive, medical, and industrial applications, packaging finds itself in the forefront of enabling new features required for growth in these markets. The need to further customize packaging for such applications will play a much bigger role moving forward in order to enable device solutions that previously were not possible.

Author
 Texas Instruments

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http://www.ti.com/uqfn

Companies
Texas Instruments

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