19 March 2012 Bare-Die Small Quantity Options Training Texas Instruments Incorporated has expanded package options with the additional availability of bare-die. With new small volume waffle pack quantities TI provides the capability to prototype bare-die applications quickly without the need to purchase a full wafer. TI's bare-die enables customers to design end equipments with smaller form factors by implementing multi-chip modules (MCM) or system in package (SiP). Moving to more integrated packaging solutions provides both weight and power dissipation savings while improving overall system-level reliability in space-constrained applications. Author Texas Instruments Comment on this article Websites http://www.ti.com/die Companies Texas Instruments Deutschland This material is protected by MA Business copyright See Terms and Conditions. One-off usage is permitted but bulk copying is not. For multiple copies contact the sales team. What you think about this article: Add your comments Name Email Comments Your comments/feedback may be edited prior to publishing. Not all entries will be published. Please view our Terms and Conditions before leaving a comment.