comment on this article

Bare-Die Small Quantity Options Training

Texas Instruments Incorporated has expanded package options with the additional availability of bare-die. With new small volume waffle pack quantities TI provides the capability to prototype bare-die applications quickly without the need to purchase a full wafer.

TI's bare-die enables customers to design end equipments with smaller form factors by implementing multi-chip modules (MCM) or system in package (SiP). Moving to more integrated packaging solutions provides both weight and power dissipation savings while improving overall system-level reliability in space-constrained applications.

Texas Instruments

Comment on this article

This material is protected by Findlay Media copyright See Terms and Conditions. One-off usage is permitted but bulk copying is not. For multiple copies contact the sales team.

Enjoy this story? People who read this article also read...

What you think about this article:

Add your comments


Your comments/feedback may be edited prior to publishing. Not all entries will be published.
Please view our Terms and Conditions before leaving a comment.

Related Articles

What is EMC testing?

Testing of products under EU guidelines to ensure they don't either pollute the ...

On-chip debug logic

This whitepaper outlines Altera and ARM's latest innovations in on-chip debug ...

Crystal resonators

AEL Crystals has added to its family of quartz based frequency control products.