comment on this article

Bare-Die Small Quantity Options Training

Texas Instruments Incorporated has expanded package options with the additional availability of bare-die. With new small volume waffle pack quantities TI provides the capability to prototype bare-die applications quickly without the need to purchase a full wafer.

TI's bare-die enables customers to design end equipments with smaller form factors by implementing multi-chip modules (MCM) or system in package (SiP). Moving to more integrated packaging solutions provides both weight and power dissipation savings while improving overall system-level reliability in space-constrained applications.

Texas Instruments

Comment on this article

This material is protected by MA Business copyright See Terms and Conditions. One-off usage is permitted but bulk copying is not. For multiple copies contact the sales team.

What you think about this article:

Add your comments


Your comments/feedback may be edited prior to publishing. Not all entries will be published.
Please view our Terms and Conditions before leaving a comment.

Related Articles

Keeping your cool

Electronic devices get hot, but how hot depends upon a range of factors. ...

All about timing!

Modern technology relies heavily on accurate timing as its fundamental basis, ...

What is EMC testing?

Testing of products under EU guidelines to ensure they don't either pollute the ...

LED matrix control IC

Omron Electronic Components has launched a LED matrix control IC that supports ...

Circuit protection

Circuit protection is designed as an intentional weak link which can combat ...

Avoid epic failure

Consumers expect today's electronics to be faster, smaller and highly reliable. ...