19 March 2012
Bare-Die Small Quantity Options Training
Texas Instruments Incorporated has expanded package options with the additional availability of bare-die. With new small volume waffle pack quantities TI provides the capability to prototype bare-die applications quickly without the need to purchase a full wafer.
TI's bare-die enables customers to design end equipments with smaller form factors by implementing multi-chip modules (MCM) or system in package (SiP). Moving to more integrated packaging solutions provides both weight and power dissipation savings while improving overall system-level reliability in space-constrained applications.
Texas Instruments Deutschland
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