19 March 2012 Bare-Die Small Quantity Options Training Texas Instruments Incorporated has expanded package options with the additional availability of bare-die. With new small volume waffle pack quantities TI provides the capability to prototype bare-die applications quickly without the need to purchase a full wafer. TI's bare-die enables customers to design end equipments with smaller form factors by implementing multi-chip modules (MCM) or system in package (SiP). Moving to more integrated packaging solutions provides both weight and power dissipation savings while improving overall system-level reliability in space-constrained applications. Author Texas Instruments Comment on this article Websites http://www.ti.com/die Companies Texas Instruments Deutschland This material is protected by Findlay Media copyright See Terms and Conditions. One-off usage is permitted but bulk copying is not. For multiple copies contact the sales team. Enjoy this story? People who read this article also read... Alternative back-up power With outdoor events like concerts, events and festivals now ... Read Article NIDays 2013 NIDays is a technical conference designed specifically for ... Read Article Southern Manufacturing This year, Southern Manufacturing and Electronics is set to be ... Read Article Microcontrollers deliver ... Microchip has launched what it describes as the 'world's lowest ... Read Article What you think about this article: Add your comments Name Email Comments Your comments/feedback may be edited prior to publishing. Not all entries will be published. Please view our Terms and Conditions before leaving a comment.