comment on this article

Good designs don't feel the heat

Thermal analysis tools continue to develop while materials improve a little, but the laws of physics remain the same. By Tom Shelley.

Engineers are continually tasked with dissipating more heat within smaller spaces and while there are three basic approaches to thermal management, software is also playing a part.
Some improvements have been made in conducting heat away from active components in the design of power devices, thanks to making the silicon die thinner. This reduces the thickness of insulating silicon between the active parts and the heat sink.

An increasingly wide range of silicone based products for thermal management provide conduction paths to the exterior parts of laptop computers and mobile phones, or to metal heat sinks. Commercially available products include thermally conductive insulator pads, adhesive tapes, gap filling sheets and cure-in-place compounds.

The ultimate material for thermal conduction within electronics is undoubtedly synthetic diamond, which is normally a first class insulator with four times the thermal conductivity of copper.

Click here to request this article by email

Author
Graham Pitcher

Comment on this article


This material is protected by MA Business copyright See Terms and Conditions. One-off usage is permitted but bulk copying is not. For multiple copies contact the sales team.

What you think about this article:


Add your comments

Name
 
Email
 
Comments
 

Your comments/feedback may be edited prior to publishing. Not all entries will be published.
Please view our Terms and Conditions before leaving a comment.

Related Articles