Technology Filtered by - Board Level Design

New Electronics strives to bring you all the latest technology news from the Board Level Design sector. Advances in electronics are often fast-paced and innovative, so we know that as a design engineer you want to be kept up-to-date with current developments.

Below is a comprehensive list of all the latest electronics technology news from New Electronics.

Going circular

Technology manufacturers are increasingly being encouraged to think about the circular economy – the concept that materials and goods should be kept in circulation for longer rather than follow the traditional ‘linear’ model of make, sell, use, then dispose.

An in-house prototyping revolution

At a time when the capabilities of electronic products are breaking new ground, it could be true to say that their potential is being held back by design, development and production processes that haven’t kept pace with the speed of innovation.

Meeting the PCB design challenge

Although the IoT is still in its early days, applications developers are already looking to put more electronics into smaller packages. Not only that, many products are being designed to fit into odd shapes or to fit into whatever space may be available in existing devices.

How to cope with data intensive IoT applications

The downstream performance requirements of SaaS and streaming services are increasing constantly. The same goes for upstream workloads, which are rising dramatically as a result of IoT applications with voice control or with tens of thousands of vision sensors.

Snapdragon processors for embedded systems

Since its establishment in 1985, Qualcomm has been involved in the mobile communications market, although its Qualcomm Technologies arm has made forays into other areas, such as MEMs based displays and wireless vehicle charging.

Are PCB design skills keeping up with increasing complexity?

It may seem something of an understatement, but Phil Mayo, director of sales for Altium UK, believes: “The PCB is important.” And perhaps that’s one reason why the workshop and conference sessions addressing PCB design at last year’s Electronics Design Show (EDS) attracted record numbers of engineers.

Composite amplifiers can improve performance

It is a familiar situation. An application needs an amplifier with excellent output drive capability, say several hundred milliamps, to drive a large capacitive load. The supplier’s engineering team can fairly quickly recommend a suitable part. But then the designers throw in additional requirements, such as low noise and high DC precision. This time, no single device is available to meet that specification. While you might think that placing a precision amplifier and high-output-current amplifier in series would give designers the best of both worlds, sadly, this turns out to be not the case.

Linear Technology's Bruce Hemp and James Wong bring ease of use to microwave radio design

Bandwidth is rapidly expanding in the next generation wireless access to cope with the ever-increasing Internet traffic. At the same time, the current available spectrum in use simply cannot support the needed bandwidth. So higher frequency spectrums are being evaluated for suitability. Multiple options are considered, ranging from unlicensed 5.8GHz terrestrial stations, to fleets of low-orbit satellites that blanket the earth. The path to higher bandwidth lies with new higher frequencies to deliver on that promise. New mixers with improved performance will be needed. A new mixer, the LTC5549 from Linear Technology, is launched to support this effort.

Can 3D printing transform PCB prototyping?

The hardware and software powering today’s electronic devices have evolved at breakneck speed, but one crucial bottleneck remains – prototyping, in particular unforeseen and costly delays during PCB development. In response 3D printing is now being deployed in the production of professional PCBs delivering benefits in terms of time savings, costs and innovation.

3U VPX module wins PCB design competition

Form factors, new technology, thermal management and the need for more voltage rails are some of the challenges which face those designing board level products. While software is helping to address the challenges, the success or otherwise of the design comes down to good, old fashioned team work and skill.

Squeezing the performance out of ATCA through virtualisation

It is more than 10 years since the release of PICMG 3.0, the standard which defined the Advanced Telecom Computing Architecture (ATCA). Deployed in many parts of the ‘network’, ATCA is now beginning to be adopted in markets such as military and aerospace, where highly reliable computing is a hard necessity.

1D to 3D HMI solutions

Just a few years ago Touch revolutionised input: mechanical buttons, keyboards and sliders were replaced by static plastic or metal surfaces. It meant that operator interfaces could be incorporated into a device, and unobtrusive and modern design became increasingly common on the factory floor. Capacitive touch is based on a capacitor whereby the human finger acts as the actuator for the capacitor. Ingenious designs also enable proximity switches to be implemented as well. In this case the control system is only active shortly before it is activated, reducing energy consumption. This is known as ‘1D’ input.

Minimising costs for wire-to-board connections

Wire-to-board connections incur high costs when handling large quantities in mass markets. However, using the right connection technology this expense can be prevented. It's often worth considering the use of tried-and-tested technologies that enable cables and circuit boards to be connected at little cost.

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