Distribution

New Electronics brings you the latest news from the electronic components distribution sector, including updates on franchises, market information and the availability of new products. We also bring you updates from industry associations in the UK and Europe.

This section is updated regularly, so make sure you stay up-to-date with the latest distribution news by bookmarking this page.

Tracking WiFi signals to passively see through walls using NI USRP and LabVIEW

With dedication and a creative approach, University College London (UCL) research is helping to address the world's most urgent problems. Whether designing healthier cities or grappling with issues such as global health and climate change, the challenges of daily life inspire UCL students and academics. Based at UCL, our team of electrical engineering researchers is investigating passive radar technologies that can see through walls using WiFi radio waves.

What is viable and what is not with 3D printed enclosures

Unless you've been under a rock for the last 10 years, you will have heard about 3D printing. But many engineers are still wondering how they can use it for anything other than prototyping. However, 3D printing can provide a cost effective way to construct custom enclosures and this article will explain how, when and why you should consider using 3D printing for your product.

A layered approach to enhancing security for safety-critical software

Today’s safety-critical embedded environments are becoming more connected to the outside world. The ongoing growth of the Internet and IoT solutions will further drive connectivity requirements for safety-critical systems for the foreseeable future. Aerospace, defence, automotive, medical and industrial control are just some of the vertical markets that will expand as the ability to interconnect and remotely work with devices grows.

Sensors for a smart environment

Sensors have evolved from simple measuring tools to smart appliances that are connected through the internet to the cloud and to each other. At the recent ISSCC-conference, researchers from imec and Holst Centre presented a number of developments which may pave the way to a world where sensors assist us to drive more safely, live more healthily and make the planet more sustainable.

ATEX and how this applies to power supplies

The acronym ATEX, derived from the French phrase "ATmosphere EXplosible”, was initially introduced in the European Union to facilitate the free movement of goods and services of equipment used in hazardous environments.The resulting ATEX Directive removed the need to test and document a product for each EU country by harmonising the way different hazardous explosive environments are classified across all industries.

How designers can take advantage of the latest product developments in intelligent power modules

The move to replace simple fixed speed motor drives with more sophisticated variable speed drives (VSDs) is gathering pace, driven by regulations such as the European Commission’s ErP (Energy related Products) Directive. As a result, manufacturers of electric motors are equipping their products with the ability to match their speed and power output to the load, providing for a reduction in average power consumption.

CES 2016 suggests technology business is alive and well

Looking for a drone? Angling for an HDR enabled TV or a virtual reality headset? Want the latest in smart home devices or to find out more about recent developments in autonomous vehicles, then the Consumer Electronics Show (CES), held in Las Vegas last month, wouldn’t have disappointed.

What is the usable power in a DC/DC converter?

The term ‘high usable power’ is widely used by the manufacturers of DC/DC converters to describe their product’s performance. Many engineers though tend to focus on the datasheet’s rated current and assume that, by selecting a more expensive, higher power converter, it will give them more derating and improved reliability.

Expect broader application of software-driven hardware verification in 2016

The system and semiconductor worlds are in transition. In the past, the focus in verification used to be on bug identification. Today, the electronic design industry is seeing a shift towards greater efficiency in finding bug root causes and in bug remediation. To that end, SoC providers have been looking to provide software with their products. While this higher value speeds design in time, it has the tendency to increase verification complexity and moves the responsibility of hardware-software verification to the SoC provider. As a result, in 2016, we can expect to see broad application of software-driven hardware verification methodologies.

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