Technology Filtered by - Interface/Interconnect

New Electronics strives to bring you all the latest technology news from the Interface/Interconnect sector. Advances in electronics are often fast-paced and innovative, so we know that as a design engineer you want to be kept up-to-date with current developments.

Below is a comprehensive list of all the latest electronics technology news from New Electronics.

Interconnector and cabling system to address design challenges

The growth in connectivity, with billions of devices now connected around the globe, means the pressure is growing exponentially on the infrastructure that supports the collection and dissemination of data. Whatever the technical pressures, customers expect a seamless level of service.

Choosing between PCAP and resistive touchscreen technologies

Resistive touchscreens are typically found in retail electronic point of sale (EPOS) devices and companies have traditionally used them in industry. These have several layers, including two thin transparent, electrically resistive layers, separated by a thin space. When an object such as a fingertip or stylus tip presses down on the outer surface, the two layers touch to become connected. These touchscreens simply need enough pressure for the touch to be sensed and can be used while wearing gloves or other personal protective equipment (PPE).

The rise of the hyperscale data centre

The modern data centre is becoming more complex as it attempts to handle the proliferation in mobile devices and billions of newly connected devices, all of which are increasing the pressure on data infrastructure. Customer expectations have never been higher and they will expect a seamless level of service, even as the demand for data increases exponentially.

Connector to combat passive inter modulation on mobile networks

Passive inter modulation – PIM – is ‘unwanted interference’ which tends to occur when two or more interacting signals either interfere with one another or are affected by outside interference. While PIM is not new, the development of Long Term Evolution (LTE), 4G and 5G generation networks means that it has become more important as an issue. These networks have proven to be far more vulnerable to the effects of PIM, as well as to other signalling problems.

Data centre interconnect drives optical module advances

The huge growth in demand for video, cloud services and social networking is changing almost everything about the way the networks are built and used, not least the interconnect technologies within data centres and the ‘top of rack’ network switches that shift packets between the optical internet boxes – or Data Centre Interconnect (DCI) – and the servers that store and process the data.

M2.COM Internet of Things sensor platform unveiled

According to its creators – Advantech, ARM, Bosch, Texas Instruments and Sensirion – M2.COM is an evolutionary module technology designed specifically for IoT sensors and devices. With networking, computing and data collection features on one module, M2.COM is intended to help transform obsolete applications into IoT generation solutions. The partners note the modular design is said to make the concept flexible enough to support different applications and to meet the changing demands of the IoT world.

Do UK contract manufacturers understand the concept of Industry 4.0, let alone employ it?

Contract manufacturers have an increasingly important role to play in the UK’s manufacturing ecosystem, whether that is in supporting volume production or new and emerging businesses looking to take new products from concept to volume assembly. According to figures from the Electronic Components Supply Network (ECSN), the CEM sector in the UK and Ireland now, in terms of demand, accounts for more than 40% of all electronic components by value.

1D to 3D HMI solutions

Just a few years ago Touch revolutionised input: mechanical buttons, keyboards and sliders were replaced by static plastic or metal surfaces. It meant that operator interfaces could be incorporated into a device, and unobtrusive and modern design became increasingly common on the factory floor. Capacitive touch is based on a capacitor whereby the human finger acts as the actuator for the capacitor. Ingenious designs also enable proximity switches to be implemented as well. In this case the control system is only active shortly before it is activated, reducing energy consumption. This is known as ‘1D’ input.

Minimising costs for wire-to-board connections

Wire-to-board connections incur high costs when handling large quantities in mass markets. However, using the right connection technology this expense can be prevented. It's often worth considering the use of tried-and-tested technologies that enable cables and circuit boards to be connected at little cost.

The benefits of exploiting M2M connectivity?

Over the years, a number of different methods have been used for establishing remote connections between industrial systems and sensors, including fixed connections, low power radio links, Bluetooth and Wi-Fi. But most are only feasible over relatively short distances or where existing connections, such as a telephone line, fibre optic cable, or dedicated point to point link, are already installed. A new technology using 'white space' spectrum has also been proposed, but this would involve commissioning a whole new network.

Interconnection opportunities in the rail sector abound as investment booms

Rail is proving to be one of the most attractive and fast growing markets for the electronics industry. Deregulation, new leasing and financing schemes help to support operator demand for additional rail stock and the UK has an active rail market, with major investments in both large infrastructure projects and in rolling stock – HS2 and Crossrail are providing significant opportunities for both Tier 1 and Tier 2 manufacturers. UK manufacturers are also competing to win business in the Far East in the form of sub systems on the Beijing High Speed network, for example, and in the US with the proposed New York to California high speed rail link planned for delivery in 2020.

Powering mobile devices with ICs is becoming easier

Whilst low power precision components have enabled rapid growth of the mobile device market, those portable products targeted at industrial, medical and military applications typically have much higher standards for reliability, run time and robustness. Much of this burden falls on the power system and its components.

Designing for rail: The importance of specifying the right connectors

The rail sector appears to be on the right track across Europe but particularly in the UK. HS2, which is still on the horizon, is a topic for much discussion, but there are plenty of major active projects. Highlights include: the Intercity Express Programme, that will see Hitachi bring new rolling stock for mainline services in three years; the ongoing Thameslink project that is cutting through (or under) the centre of London; and Crossrail, Europe's biggest infrastructure project, which will see new trains supplied by Bombardier.

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