Technology News

New Electronics brings you up-to-date Technology News, covering the full spectrum of new and emerging technologies, invention and innovation.

Qualcomm and SenseTime to drive on-device artificial intelligence

Qualcomm Technologies and SenseTime have revealed that they will be collaborating on artificial intelligence (AI) and machine learning (ML) for future mobile and IoT products.

The collaboration will involve leveraging SenseTime’s ML models and algorithms with Qualcomm’s Snapdragon platforms which offer advanced heterogeneous computing capabilities for client based AI. The companies are expected to focus on vision and camera-based image processing. SenseTime is ...

Companies announce AI partnership

CEVA, a licensor of signal processing IP and Brodmann17, a developer of deep learning technology, have announced a partnership with the aim at accelerating the deployment of deep learning computer vision in mainstream applications.

Terahertz spectroscopy goes nano

Brown University researchers have demonstrated a way to bring a powerful form of spectroscopy -- a technique used to study a wide variety of materials -- into the nano-world.

RS stocking new pi-top modular laptop

RS Components (RS) has announced that it is now stocking the latest-generation pi-top modular laptops,  launched today by the pi-top organisation, featuring new enhancements intended to assist learning and boost usability.

Paper based supercapacitor could power wearables

Using a simple layer-by-layer coating technique, researchers from Georgia Tech and Korea University have developed a paper-based flexible supercapacitor that could be used to help power wearable devices. The device uses metallic nanoparticles to coat cellulose fibres in the paper, creating supercapacitor electrodes with high energy and power densities – and the best performance so far in a textile-based supercapacitor.

Microchannels cool high performance processors

As part of the CarriCool project, Fraunhofer researchers have worked with IBM to develop what is said to be an effective method for cooling processors. According to the team, by integrating microchannels into the silicon interposer, a significant increase in performance can be achieved. Meanwhile, the team has also integrated passive components for voltage regulators, photonic ICs and optical waveguides into the interposer.

Teledyne e2v sensors to equip the LSST

Teledyne e2v has been awarded a multimillion dollar contract by SLAC National Accelerator Laboratory (SLAC) to supply customised Charge Coupled Device (CCD) image sensors for the Large Synoptic Survey Telescope.

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