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Latest News
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Power semiconductor specialist Semikron has developed a new packaging technology which is said to remove the need for bond wires, solders and thermal paste. Called SKiN technology, the approach is based on the use of a flexible foil and sintered connections.
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A new generation of intelligent igbt modules from Semikron is said to offer longer service life than non sintered modules. The parts can also be used in higher temperature applications.
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