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Latest News
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TSMC says it will have completed its 45nm technology qualification in time to move to full production this September. The 45nm process combines advanced 193nm immersion photolithography, strained silicon and extreme low k dielectrics.
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TSMC has unveiled a 55nm process technology, a linear shrink from its existing 65nm process, including I/O and analogue circuits.
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Responding to soaring demand for embedded memory, TSMC has inked a technology development and licensing agreement with flash memory leader, SST, to provide 90nm embedded flash technology.
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