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Latest News
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Researchers claim to have developed a new technology that makes pressure sensors more robust, enabling them to continue operating normally at temperatures up to 250°C.
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With miniaturisation of electronic components pushing towards the nanoscale, engineering challenges are growing. In a move to address these challenges, a consortium of leading microelectronics companies and research institutions has announced a European initiative aimed at improving engineering efficiency. The project, called NanoInterface, has won funding under the European Union's Seventh Framework Program.
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Point 35 Microstructures and the Fraunhofer Institute have unveiled a module solution for advanced MEMS processing.
The module enables an amporphous silicon film to be deposited as a sacrificial etch layer in a modified PECVD reactor. This layer can then be etched using the memsstar SVR system.
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