26 July 2011

Junction box features integrated and sealed one component design

TE Connectivity has released a new low profile junction box for BIPV glass-glass crystalline solar modules.

The SOLARLOK wing edge junction box features an integrated and sealed one component design and is specifically designed for the easy automatic glass-glass module lamination process. The junction box is connected to the foils before the lamination process without attaching any cable assemblies. This new process allows a straightforward, clean and convenient lamination process as no silicon glue is required to mount the product with the glass edge.
The process also eliminates complicated and time consuming connection work for the device after lamination, removing any risk of damage to the foils. The cable assemblies can easily be connected to the junction box in the field using SOLARLOK slim line connectors.

The SOLARLOK wing edge junction box does not require any potting of the inside and benefits from very small dimensions of only 105.8x15.5x12.5mm, saving space in the installation. It is available with a 12 Amp current rating for crystalline applications. The device is TÜV approved (according to VDE0126-5) with a 1000Vdc rating to meet the performance requirements of the photovoltaic industry. It offers a connectorised solution for easy module cell expansion. It is not released for the US market.

The housing of the junction box is sealed to IP67. The SOLARLOK slim line connectors feature a latching locking feature and are also sealed to IP67.

Author
TE Connectivity

Supporting Information

Websites
http://www.te.com/help

Companies
TE Connectivity Ltd

This material is protected by Findlay Media copyright
See Terms and Conditions.
One-off usage is permitted but bulk copying is not.
For multiple copies contact the sales team.

Do you have any comments about this article?


Add your comments

Name
 
Email
 
Comments
 

Your comments/feedback may be edited prior to publishing. Not all entries will be published.
Please view our Terms and Conditions before leaving a comment.

Related Articles

Toshiba Bluetooth IC

Toshiba has introduced a low power Bluetooth IC that supports Bluetooth Low ...

Bendable optical interconnect

Researchers from Ghent University have created what they believe may be the ...

Power IC for next gen EVs

A single channel power IC, designed to bring the sound of a conventional ...

Interconnect: Polymer fibres

Fibre optics are good for transmitting high speed data across the Atlantic, but ...

Making the standard start

Connectors are not the glamorous end of the market. They are expected to do ...

Connecting with compliance

When the Reduction of Hazardous Substances (RoHS) Directive came into force in ...

Connecting to Android Platform

This white paper from FTDI Chip will describe some of the options for ...

Transparent Electronics Market

Emerging market opportunity analyst, NanoMarkets, believes that three major ...

Securing Smart Grid Devices Using ...

Energy providers and governments worldwide are looking for ways to upgrade ...

Synchronous buck regulator IC

The A8672 from Allegro MicroSystems Europe is a synchronous buck regulator IC ...

Current sensing IC

International Rectifier has launched the IR25750, a general purpose current ...

Power management ICs

A new family of power management ICs, aimed at RF agile radio and FPGA based ...

RFIC simplifies design process

Nikolaus Klemmer, High Speed Products, has been developing communcations ...

Home automation system

Manage your home with TI technology and control various home applications ...

SN65LVDS324 overview

Ross demonstrates an easy and low cost way to build a video camera system that ...

Communication breakdown

Last week's Anti Counterfeiting Forum, organised by UKEA and The Electronics ...

Connectivity, the new essential service

One of the legacies of having an engineering background is that, inevitability, ...

Regulated power?

Power supply specialists will no doubt be raising an eyebrow at a report which ...

Patrick Zammit, Avnet

Patrick Zammit, president, Avnet Electronics Marketing EMEA, talks with Chris ...

Keate Despain, Radisys

Keate Despain, senior director of product line marketing, Radisys, talks with ...

Claire Jeffreys, NEW

Claire Jeffreys, events director, National Electronics Week, talks with Chris ...