13 September 2011
Advanced LIN physical layer devices
Freescale Semiconductor has announced an advanced family of local interconnect network (LIN) physical layer components.
The devices are designed to enhance network communication within a vehicle by combining low noise emission with high electromagnetic immunity (emi) robustness and high performance electrostatic discharge (esd) protection. The MC33662 family complies with the latest LIN automotive OEM acceptance standards - LIN 2.1 and J2602-2. It is a standalone LIN physical layer component that offers compatibility with automotive and industrial LIN standards. The device is suitable for applications such as water pumps, rear wipers, rear climate control, remote controls, column position sensors, accessory switch monitors, seat memory, window lifts and sunroof control.
The range meets the requirements of automotive LIN design, withstanding severe automotive esd stresses and offering a robust physical layer. Innovations in transistor models and simulation accuracy have resulted in superior signal integrity across all emi frequency ranges when a direct power injection stress is applied.
According to Freescale, features include reduction of noise emission: 15dBuV below standard industry solutions (in low frequency range); high signal immunity performance against power injection: direct power injection (34dBm flat) with and without external capacitor on LIN, and bulk current injection immunity up to 1GHz; high esd protection (greater than 15kV unpowered and 10kV powered, according to ISO10605); and a low quiescent consumption in low power mode (6uA).
Author
Freescale Semiconductor
Supporting Information
Websites
http://www.freescale.com/analog
Companies
Freescale Semiconductor
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