01 February 2012

AC/DC power distribution connector system

Connector and interconnect manufacturer, FCI has announced the PwrBlade+ ac/dc power distribution connector system – a next generation power connector, focused on demanding power applications requiring higher linear current density and low power loss.

According to FCI, it is capable of 192A/linear inch with eight adjacent high power contacts energised simultaneously and = 0.7mO power contact resistance after environmental exposure.

The PwrBlade+ connector builds on the PwrBlade connector's technology but includes enhancements to achieve increased performance and density. It is rated up to 75A per power contact without exceeding a 30°C temperature rise in still air. FCI says the product features an innovative high power contact design and housing that allows higher current carrying capability in a more compact package.

"The high power contact features an optimised beam design and material property enhancements that significantly increase linear current density making it ideal for next generation 1U/2U servers, storage enclosures, telecommunications equipment and datacom/networking equipment," said John Dodds, global power business development manager at FCI.

The connector also features a highly vented, halogen free housing design, a low power contact option for applications with multiple voltages and lower power requirements and half bullet guides for a reduced connector footprint. It is available with power and signal contacts integrated into a single molded housing for power distribution and power control. Similar to other FCI power solutions, it is modularly tooled making the product highly configurable in terms of the number and placement of the power and signal contacts for custom power needs.

Right angle and co-planar options are available to accommodate various system architectures.

Author
FCI

Supporting Information

Websites
http://www.fciconnect.com/powersolutions

Companies
FCI Connectors (UK) Ltd

This material is protected by Findlay Media copyright
See Terms and Conditions.
One-off usage is permitted but bulk copying is not.
For multiple copies contact the sales team.

Do you have any comments about this article?


Add your comments

Name
 
Email
 
Comments
 

Your comments/feedback may be edited prior to publishing. Not all entries will be published.
Please view our Terms and Conditions before leaving a comment.

Related Articles

Toshiba Bluetooth IC

Toshiba has introduced a low power Bluetooth IC that supports Bluetooth Low ...

Bendable optical interconnect

Researchers from Ghent University have created what they believe may be the ...

Power IC for next gen EVs

A single channel power IC, designed to bring the sound of a conventional ...

Interconnect: Polymer fibres

Fibre optics are good for transmitting high speed data across the Atlantic, but ...

Making the standard start

Connectors are not the glamorous end of the market. They are expected to do ...

Connecting with compliance

When the Reduction of Hazardous Substances (RoHS) Directive came into force in ...

Connecting to Android Platform

This white paper from FTDI Chip will describe some of the options for ...

XMOS XS1 Architecture

An XS1 combines a number of XCore processors, each with its own memory, on a ...

Synchronous buck regulator IC

The A8672 from Allegro MicroSystems Europe is a synchronous buck regulator IC ...

Current sensing IC

International Rectifier has launched the IR25750, a general purpose current ...

Power management ICs

A new family of power management ICs, aimed at RF agile radio and FPGA based ...

RFIC simplifies design process

Nikolaus Klemmer, High Speed Products, has been developing communcations ...

Home automation system

Manage your home with TI technology and control various home applications ...

SN65LVDS324 overview

Ross demonstrates an easy and low cost way to build a video camera system that ...

Connectivity, the new essential service

One of the legacies of having an engineering background is that, inevitability, ...

Patrick Zammit, Avnet

Patrick Zammit, president, Avnet Electronics Marketing EMEA, talks with Chris ...

Claire Jeffreys, NEW

Claire Jeffreys, events director, National Electronics Week, talks with Chris ...