13 November 2012

electronica 2012: Xilinx looks to keep its lead at 20nm

Looking to maintain what it calls a 'generation lead', Xilinx has outlined its product strategy for 20nm based devices.

The company's European marketing director Giles Peckham, told New Electronics: "The 20nm strategy is building on what Xilinx can offer at 28nm, where we announced a breakout strategy that moved programmable logic on towards all programmable logic, including SoCs and 3d ics."

Central to Xilinx' 20nm plans is offering developers 'more bang for their buck'. In Peckham's opinion, 20nm devices will not only offer the best power/performance, they will also allow engineers to take a system level view of their designs and to get products to market more quickly.

The 20nm node will see all devices made using the HPLP process developed in association with TSMC. Xilinx says it will use this process as a means of driving towards a higher level of system integration.

At the 20nm node, fpgas will feature 33G transceivers and the largest device planned will have more than 100 transceivers. System level performance is said to be doubled and, by tuning the architecture,
Peckham said utilisation of more than 90% would be possible without routing issues.

Second generation SoCs, as the 20nm devices will be called, will move to heterogeneous multicore architectures, with optimised interfaces between the processor subsystem and the fpga fabric. Finally, 3d ics will support heterogeneous and homogeneous approaches, with wider memory interfaces and higher level transceivers; potentially 56G.

Interposer technology will be critical to the 3d device and Xilinx will be offering two approaches: one supporting heterogeneous dice; the other for homogenous parts.

*For more, see the Nov 27 issue of New Electronics.

Author
Graham Pitcher

Supporting Information

Websites
http://www.xilinx.com

Companies
Xilinx Ltd

This material is protected by Findlay Media copyright
See Terms and Conditions.
One-off usage is permitted but bulk copying is not.
For multiple copies contact the sales team.

Do you have any comments about this article?

Add your comments

Name
 
Email
 
Comments
 

Your comments/feedback may be edited prior to publishing. Not all entries will be published.
Please view our Terms and Conditions before leaving a comment.

Related Articles

Dialog unveils SmartBond chip

Looking to break into the booming wireless market, Dialog Semiconductor has ...

Cadence buys

Cadence has acquired the IP business of Polish firm Evatronix. The company's ...

Intel unveils Silvermont

Intel has taken the wraps off its new 22nm Atom core microarchitecture, ...

Cutting the power bill

SoCs are getting smaller and faster, but smaller node geometries leak more ...

The fight against fakes

The counterfeiting of electronic components continues to rise alarmingly. IHS ...

Digital design

When mobile phones were used only to make voice calls and to send texts, the ...

SoC challenges

This whitepaper explores an advanced motor drive or inverter application to ...

Texas Instruments Low Power RF Selection ...

The new updated Low Power RF Selection Guide from Texas Instruments includes ...

FSI image sensors

Toshiba Electronics Europe has added two new devices to its cmos image sensor ...

Flexible PLC modem SoC

ON Semiconductor has introduced a new power line carrier (PLC) modem system on ...

High speed metasimulator

The High Sigma Monte Carlo (HSMC) metasimulator from Solido Design Automation ...

Embedded G-Series SoC

Looking to reduce its dependence on the pc market, AMD has launched the ...

TI's newest base station SoC

In TI's Ask the Experts video series, get answers to your most common technical ...

TI's base station SoC

As wireless data rates move toward the future with even faster 4G services, the ...

Cadence targets IP leadership

In a report from December 2012's IPSoC conference in Grenoble, Louise Joselyn ...

Patent trolls

Not only has the world become more litigious, it also seems to place more value ...

ASICs still have a role to play

Gartner Dataquest tells us asic design starts are likely to decline by 22% this ...

Claire Jeffreys, NEW

Claire Jeffreys, events director, National Electronics Week, talks with Chris ...

Moshe Gavrielov, ceo, Xilinx

Moshe Gavrielov, Xilinx' president and ceo speaks with New Electronics