07 November 2012

Multi layer, flexible pcb is 'world's largest'

Gloucestershire based company Trackwise has developed a technique for manufacturing flexible printed circuit boards of any length.

For aerospace and other high value, mass critical applications, the pcbs can be used as an alternative to traditional wiring harnesses, offering space and weight savings of up to 75%.

Company md Philip Johnston said: "Flexible multi layer pcbs were originally developed in the second half of the 20th century as a replacement for wiring cable but due to length limitations the cable or harnesses replaced were typically internal to equipment rather than point to point harness replacement.

"Any longer runs of pcb would have to be made via intermediate connections, representing additional weight, cost and complexity as well as a source of potential unreliability. Our recent innovation means that these intermediate interconnects can be removed."

Trackwise is just one of more than 30 high tech companies in the Innovation Showcase at Venturefest Bristol 2012. For more info visit http://www.sciencecitybristol.com/pages/31-innovation-showcase

Author
Laura Hopperton

Supporting Information

Websites
http://www.trackwise.co.uk/

This material is protected by Findlay Media copyright
See Terms and Conditions.
One-off usage is permitted but bulk copying is not.
For multiple copies contact the sales team.

Do you have any comments about this article?

Add your comments

Name
 
Email
 
Comments
 

Your comments/feedback may be edited prior to publishing. Not all entries will be published.
Please view our Terms and Conditions before leaving a comment.

Related Articles

Scaled down electronics

A team from North Carolina State University has developed a technique for ...

Flexible electronics advance

A new class of transparent electrodes has been discovered that could soon find ...

Wearable sensor developed

A new type of wearable sensor has been developed that could greatly improve the ...

Battery revolution on the way?

Since the invention of the battery by Volta in the early days of the 19th ...

Atomic force microscopy

The microscope is one of science's oldest tools for examining nature, going ...

ASIC/SoC prototyping platforms

Time to market pressures and growing design complexity are steering SoC ...

Capactive sensing

This whitepaper looks at a number of capacitive sensing applications to ...

Altium's Innovation Station

An introduction to the Altium Innovation Station. It includes an overview of ...

Eclipse-based embedded IDE combines best of ...

Software development tools for embedded systems have evolved in an interesting ...

IBM tackles 22nm challenges

IBM has announced the semiconductor industry’s first computationally based ...

BEEAs 2013

24th October 2013, 8 Northumberland, London

AFEs for photometry

TI's AFE4400 and AFE4490 families of AFEs for photometry.

Next gen plastic electronics

A new generation of cheap, lightweight plastic electronic technology that does ...

Touch interface innovation

A new contact microphone, when connected to a system, is able to process sound ...

Top tech trends for 2013

Bee Thakore, European technical marketing manager for element14, gives an ...

Breaking the euv log jam

Lithography is probably the biggest challenge facing those developing next ...

Exploiting graphene research

Graphene is generally accepted to be the 'wonder material' in waiting; set to ...

Brent Hudson, Sagentia

Sagentia's ceo tells Graham Pitcher how the consulting company is anticipating ...

Prof Donal Bradley, Imperial

Graham Pitcher talks to a researcher who was 'there at the start' of the ...

Geoff Halls, Roke Manor

Roke Manor continues to be a world leader in communications research, but ...