06 August 2012 TSMC follows Intel and invests in ASML Shang-yi Chiang, TSMC's co chief operating officer TSMC has followed Intel's lead by investing €276million ($340m) in ASML's R&D for next generation lithography technologies, as well as €838m ($1billion) in a 5% stake in the company. "One of the biggest challenges facing ic scaling is how to effectively control the escalating wafer manufacturing cost," said Shang-yi Chiang, pictured, TSMC's co chief operating officer. "We are confident that the additional funding for ASML's R&D programs will help secure and accelerate extreme ultraviolet (EUV) development activities, in parallel with the necessary focus on improved performance of existing optical lithography tools and speed up the deployment of new technologies for 450mm wafers. This effort will help the industry control wafer cost, and therefore protect the economic viability of Moore's Law." Earlier, Intel invested $4.1bn in ASML, including €553m ($680m) in the R&D program and the remainder to acquire a 15% stake. As part of its Customer Co-Investment Program, ASML can sell up to 25% of its equity. Following the moves by Intel and TSMC, 5% of the equity remains available and ASML says this share is being discussed with other customers. Industry speculation suggests the discussions might be with Samsung. Author Graham Pitcher Comment on this article Websites http://www.asml.comhttp://www.tsmc.com Companies TSMC Europe BV This material is protected by MA Business copyright See Terms and Conditions. One-off usage is permitted but bulk copying is not. For multiple copies contact the sales team. What you think about this article: Add your comments Name Email Comments Your comments/feedback may be edited prior to publishing. Not all entries will be published. Please view our Terms and Conditions before leaving a comment.