10 March 2010

Tier Logic comes out of stealth, targets design and production needs

  • programmable logic

Prompted to emergy from 'stealth mode' by recent announcements by Tabula, Tier Logic has unveiled its 3d based technology for fpgas and asics.
Tier Logic separates user circuits and configuration circuits into stacked layers. By removing the configuration overhead from the silicon base layers, Tier Logic says it can produce smaller, denser, faster, lower power and more reliable fpgas.

VP of marketing Paul Hollingworth noted: "More than half of the transistors in a modern fpga are used for configuration logic. If those are placed on a second layer using thin film transistor technology, the die size can be reduced and there is also the opportunity to replace the tft layer with metal to create an asic."
Because the timing is performed in the base layer, this remains identical between the fpga and asic, allowing 'zero risk, zero effort' conversions. Hollingworth also claimed that asics would be roughly half the cost of the fpga version.
Two benefits are claimed for the 3d approach. "Apart from smaller die size because of the shift to 3d," said Hollingworth, "you also get more efficient look up table utilisation."
He claimed the devices will suit both design and production needs. "FPGAs are ideal in the design phase, but not good in production because of cost. The situation is reversed for asics, which are difficult to get to production. Until now, nobody had a solution which works for both phases."
Hollingworth claimed 28 designs had been synthesised to Xilinx fpgas, then synthesised to Tier Logic's technology. "Our results show TierFPGAs bring between 1.8 and 3.5 times the architectural efficiency of traditional devices."
While Tier Logic isn't making any specific product announcements, the roll out of TierFPGAs will start in the near future. However, TierASICS are available now and the company is offering customers with existing fpgas who wish to take advantage of immediate conversion to TierASICs a free NRE if they place a production order for $50k or more. In addition, for an order of $100k or more, Tier Logic will create a custom pin compatible package to avoid customers having to alter existing pcbs.

Author
Graham Pitcher

Supporting Information

Websites
http://www.tierlogic.com

This material is protected by Findlay Media copyright
See Terms and Conditions.
One-off usage is permitted but bulk copying is not.
For multiple copies contact the sales team.

Do you have any comments about this article?

Add your comments

Name
 
Email
 
Comments
 

Your comments/feedback may be edited prior to publishing. Not all entries will be published.
Please view our Terms and Conditions before leaving a comment.

 

Related Articles

Nujira unveils smartphone IC

Cambridge based Nujira has released its first commercial envelope tracking chip ...

Cliff wins court case

A UK manufacturer of audio and power connectors has won a long running court ...

High brightness led deal

Plessey has acquired University of Cambridge spin out CamGaN in a move which ...

E-paper displays

Electrophoretic displays have been developed by companies such as E Ink to ...

A sense of purpose

Sensors transmitters are commonly used in process industries to help control ...

Fighting fit

Leading edge semiconductor technology is enabling the development of smaller ...

Automotive functional safety

Real time control of safety critical applications has been a longtime challenge ...

Cross platform middleware

The 2nd generation Intel Core processor family brings huge improvements in ...

Securing Smart Grid Devices Using ...

Energy providers and governments worldwide are looking for ways to upgrade ...

Embedded World: Altera

Altera will showcase a suite of embedded fpga solutions at Embedded World 2012 ...

Embedded World: Rutronik

Rutronik will be presenting application specific solutions for the lighting, ...

LIN/LDO/dual CAN transceivers

ON Semiconductor has introduced two new integrated transceiver devices for use ...

Southern Manufacturing 2012

FIVE, Farnborough, Hants, 15-16th February 2012

embedded world 2012

Taking place from 28 February to 1 March 2012.

MEDTEC UK 2012

23-24th May, Hall 9, Birmingham NEC

SimpleLink Wireless

Introduction to SimpleLink Family

Bluetooth low energy iPhone 4S

Experience the world's first demonstration of a Bluetooth low energy ...

ZigBee® RF4CE

TI's latest ZigBee® RF4CE remote control solution enables mouse-like pointing ...

If you snooze, you lose

The pace of development in the mobile phone sector has speeded noticeably in ...

CES 2012 - Intel highlights

Images: highlights from Intel's keynote at the 2012 International CES.

Photos from CES 2012

The latest photos from the Consumer Electronics Show in Las Vegas.

Aurelius Wosylus, AMD

Chris Shaw discusses AMD's latest low power processors with Aurelius Wosylus.

John Schwartz, Digi Int'l

Graham Pitcher finds out from a communications specialist that M2M is slowly ...

Rick Clemmer, ceo, NXP

Rick Clemmer believes high performance mixed signal is just one of the sectors ...