05 December 2006
Thinnest phone enabled by stacking
A combination of Agere’s 2.5G chipset and its innovative packaging technology has allowed Samsung to create what it believes is the thinnest mobile phone yet made.
The phones contain Agere’s Sceptre HPE 2.5G GSM/E-GPRS chip set and feature a packaged memory chip stacked on top of the baseband package to reduce the overall area footprint. This enables single sided component mounting
Samsung’s Ultra Edition 6.9 (X820) is less than 7mm thick and weighs 66g. The EDGE enabled device has a 2Mpixel camera, Bluetooth connectivity and an 80Mbyte memory. Meanwhile, a tv out interface allows video and photos stored on the phone to be displayed on a tv.
Author
Graham Pitcher
Supporting Information
Websites
http://www.agere.com
http://www.samsung.co.uk
Companies
Agere Systems
Samsung Electronics (UK)Ltd
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